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Solder Alloy 201 vs. C12200 Copper

Solder alloy 201 belongs to the otherwise unclassified metals classification, while C12200 copper belongs to the copper alloys. There are 23 material properties with values for both materials. Properties with values for just one material (9, in this case) are not shown.

For each property being compared, the top bar is solder alloy 201 and the bottom bar is C12200 copper.

Metric UnitsUS Customary Units

Mechanical Properties

Elastic (Young's, Tensile) Modulus, GPa 50
120
Elongation at Break, % 38
3.2 to 50
Poisson's Ratio 0.35
0.34
Shear Modulus, GPa 19
43
Tensile Strength: Ultimate (UTS), MPa 41
220 to 410

Thermal Properties

Latent Heat of Fusion, J/g 64
210
Melting Completion (Liquidus), °C 240
1080
Melting Onset (Solidus), °C 240
1030
Specific Heat Capacity, J/kg-K 220
390
Thermal Conductivity, W/m-K 28
340
Thermal Expansion, µm/m-K 21
17

Electrical Properties

Electrical Conductivity: Equal Volume, % IACS 12
85
Electrical Conductivity: Equal Weight (Specific), % IACS 15
85

Otherwise Unclassified Properties

Density, g/cm3 7.3
9.0
Embodied Carbon, kg CO2/kg material 15
2.6
Embodied Energy, MJ/kg 250
41
Embodied Water, L/kg 1320
310

Common Calculations

Stiffness to Weight: Axial, points 3.8
7.2
Stiffness to Weight: Bending, points 17
18
Strength to Weight: Axial, points 1.6
6.9 to 13
Strength to Weight: Bending, points 3.6
9.1 to 14
Thermal Diffusivity, mm2/s 17
98
Thermal Shock Resistance, points 2.7
7.9 to 15

Alloy Composition

Aluminum (Al), % 0 to 0.0010
0
Antimony (Sb), % 4.5 to 5.5
0
Arsenic (As), % 0 to 0.030
0
Bismuth (Bi), % 0 to 0.1
0
Cadmium (Cd), % 0 to 0.0020
0
Copper (Cu), % 0 to 0.050
99.9 to 99.985
Gold (Au), % 0 to 0.050
0
Indium (In), % 0 to 0.1
0
Iron (Fe), % 0 to 0.020
0
Lead (Pb), % 0 to 0.070
0
Nickel (Ni), % 0 to 0.010
0
Phosphorus (P), % 0
0.015 to 0.040
Silver (Ag), % 0 to 0.1
0
Tin (Sn), % 94 to 95.5
0
Zinc (Zn), % 0 to 0.0010
0