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Solder Alloy 201 vs. C55283 Copper

Solder alloy 201 belongs to the otherwise unclassified metals classification, while C55283 copper belongs to the copper alloys. There are 17 material properties with values for both materials. Properties with values for just one material (9, in this case) are not shown.

For each property being compared, the top bar is solder alloy 201 and the bottom bar is C55283 copper.

Metric UnitsUS Customary Units

Mechanical Properties

Elastic (Young's, Tensile) Modulus, GPa 50
100
Poisson's Ratio 0.35
0.34
Shear Modulus, GPa 19
39
Tensile Strength: Ultimate (UTS), MPa 41
190

Thermal Properties

Latent Heat of Fusion, J/g 64
190
Melting Completion (Liquidus), °C 240
720
Melting Onset (Solidus), °C 240
640
Specific Heat Capacity, J/kg-K 220
400
Thermal Expansion, µm/m-K 21
16

Otherwise Unclassified Properties

Density, g/cm3 7.3
8.6
Embodied Carbon, kg CO2/kg material 15
7.9
Embodied Energy, MJ/kg 250
120

Common Calculations

Stiffness to Weight: Axial, points 3.8
6.8
Stiffness to Weight: Bending, points 17
18
Strength to Weight: Axial, points 1.6
6.1
Strength to Weight: Bending, points 3.6
8.5
Thermal Shock Resistance, points 2.7
8.0

Alloy Composition

Aluminum (Al), % 0 to 0.0010
0
Antimony (Sb), % 4.5 to 5.5
0
Arsenic (As), % 0 to 0.030
0
Bismuth (Bi), % 0 to 0.1
0
Cadmium (Cd), % 0 to 0.0020
0
Copper (Cu), % 0 to 0.050
86.2 to 87.2
Gold (Au), % 0 to 0.050
0
Indium (In), % 0 to 0.1
0
Iron (Fe), % 0 to 0.020
0
Lead (Pb), % 0 to 0.070
0
Nickel (Ni), % 0 to 0.010
0
Phosphorus (P), % 0
7.0 to 7.5
Silver (Ag), % 0 to 0.1
5.8 to 6.2
Tin (Sn), % 94 to 95.5
0
Zinc (Zn), % 0 to 0.0010
0
Residuals, % 0
0 to 0.15