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Solder Alloy 201 vs. C71640 Copper-nickel

Solder alloy 201 belongs to the otherwise unclassified metals classification, while C71640 copper-nickel belongs to the copper alloys. There are 22 material properties with values for both materials. Properties with values for just one material (6, in this case) are not shown.

For each property being compared, the top bar is solder alloy 201 and the bottom bar is C71640 copper-nickel.

Metric UnitsUS Customary Units

Mechanical Properties

Elastic (Young's, Tensile) Modulus, GPa 50
140
Poisson's Ratio 0.35
0.33
Shear Modulus, GPa 19
52
Tensile Strength: Ultimate (UTS), MPa 41
490 to 630

Thermal Properties

Latent Heat of Fusion, J/g 64
240
Melting Completion (Liquidus), °C 240
1180
Melting Onset (Solidus), °C 240
1120
Specific Heat Capacity, J/kg-K 220
410
Thermal Conductivity, W/m-K 28
29
Thermal Expansion, µm/m-K 21
15

Electrical Properties

Electrical Conductivity: Equal Volume, % IACS 12
7.0
Electrical Conductivity: Equal Weight (Specific), % IACS 15
7.1

Otherwise Unclassified Properties

Density, g/cm3 7.3
8.9
Embodied Carbon, kg CO2/kg material 15
5.0
Embodied Energy, MJ/kg 250
73
Embodied Water, L/kg 1320
280

Common Calculations

Stiffness to Weight: Axial, points 3.8
8.7
Stiffness to Weight: Bending, points 17
20
Strength to Weight: Axial, points 1.6
15 to 20
Strength to Weight: Bending, points 3.6
16 to 18
Thermal Diffusivity, mm2/s 17
8.2
Thermal Shock Resistance, points 2.7
16 to 21

Alloy Composition


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Aluminum (Al), % 0 to 0.0010
0
Antimony (Sb), % 4.5 to 5.5
0
Arsenic (As), % 0 to 0.030
0
Bismuth (Bi), % 0 to 0.1
0
Cadmium (Cd), % 0 to 0.0020
0
Copper (Cu), % 0 to 0.050
61.7 to 67.8
Gold (Au), % 0 to 0.050
0
Indium (In), % 0 to 0.1
0
Iron (Fe), % 0 to 0.020
1.7 to 2.3
Lead (Pb), % 0 to 0.070
0 to 0.050
Manganese (Mn), % 0
1.5 to 2.5
Nickel (Ni), % 0 to 0.010
29 to 32
Silver (Ag), % 0 to 0.1
0
Tin (Sn), % 94 to 95.5
0
Zinc (Zn), % 0 to 0.0010
0 to 1.0
Residuals, % 0
0 to 0.5