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Solder Alloy 201 vs. C75400 Nickel Silver

Solder alloy 201 belongs to the otherwise unclassified metals classification, while C75400 nickel silver belongs to the copper alloys. There are 23 material properties with values for both materials. Properties with values for just one material (9, in this case) are not shown.

For each property being compared, the top bar is solder alloy 201 and the bottom bar is C75400 nickel silver.

Metric UnitsUS Customary Units

Mechanical Properties

Elastic (Young's, Tensile) Modulus, GPa 50
120
Elongation at Break, % 38
2.0 to 43
Poisson's Ratio 0.35
0.32
Shear Modulus, GPa 19
46
Tensile Strength: Ultimate (UTS), MPa 41
370 to 630

Thermal Properties

Latent Heat of Fusion, J/g 64
200
Melting Completion (Liquidus), °C 240
1080
Melting Onset (Solidus), °C 240
1040
Specific Heat Capacity, J/kg-K 220
390
Thermal Conductivity, W/m-K 28
36
Thermal Expansion, µm/m-K 21
18

Electrical Properties

Electrical Conductivity: Equal Volume, % IACS 12
7.0
Electrical Conductivity: Equal Weight (Specific), % IACS 15
7.4

Otherwise Unclassified Properties

Density, g/cm3 7.3
8.5
Embodied Carbon, kg CO2/kg material 15
3.8
Embodied Energy, MJ/kg 250
59
Embodied Water, L/kg 1320
300

Common Calculations

Stiffness to Weight: Axial, points 3.8
7.9
Stiffness to Weight: Bending, points 17
19
Strength to Weight: Axial, points 1.6
12 to 21
Strength to Weight: Bending, points 3.6
13 to 19
Thermal Diffusivity, mm2/s 17
11
Thermal Shock Resistance, points 2.7
12 to 21

Alloy Composition


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Aluminum (Al), % 0 to 0.0010
0
Antimony (Sb), % 4.5 to 5.5
0
Arsenic (As), % 0 to 0.030
0
Bismuth (Bi), % 0 to 0.1
0
Cadmium (Cd), % 0 to 0.0020
0
Copper (Cu), % 0 to 0.050
63.5 to 66.5
Gold (Au), % 0 to 0.050
0
Indium (In), % 0 to 0.1
0
Iron (Fe), % 0 to 0.020
0 to 0.25
Lead (Pb), % 0 to 0.070
0 to 0.1
Manganese (Mn), % 0
0 to 0.5
Nickel (Ni), % 0 to 0.010
14 to 16
Silver (Ag), % 0 to 0.1
0
Tin (Sn), % 94 to 95.5
0
Zinc (Zn), % 0 to 0.0010
16.2 to 22.5
Residuals, % 0
0 to 0.5