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Solder Alloy 301 vs. AWS E330H

Solder alloy 301 belongs to the otherwise unclassified metals classification, while AWS E330H belongs to the iron alloys. There are 22 material properties with values for both materials. Properties with values for just one material (7, in this case) are not shown.

For each property being compared, the top bar is solder alloy 301 and the bottom bar is AWS E330H.

Metric UnitsUS Customary Units

Mechanical Properties

Elastic (Young's, Tensile) Modulus, GPa 40
190
Elongation at Break, % 51
11
Poisson's Ratio 0.34
0.29
Shear Modulus, GPa 15
76
Tensile Strength: Ultimate (UTS), MPa 55
690

Thermal Properties

Latent Heat of Fusion, J/g 55
290
Melting Completion (Liquidus), °C 140
1400
Melting Onset (Solidus), °C 140
1350
Specific Heat Capacity, J/kg-K 160
470
Thermal Conductivity, W/m-K 19
12
Thermal Expansion, µm/m-K 14
13

Electrical Properties

Electrical Conductivity: Equal Volume, % IACS 4.7
1.7
Electrical Conductivity: Equal Weight (Specific), % IACS 4.9
1.9

Otherwise Unclassified Properties

Density, g/cm3 8.7
8.1
Embodied Carbon, kg CO2/kg material 13
5.4
Embodied Energy, MJ/kg 210
76

Common Calculations

Stiffness to Weight: Axial, points 2.5
13
Stiffness to Weight: Bending, points 13
24
Strength to Weight: Axial, points 1.8
24
Strength to Weight: Bending, points 3.7
22
Thermal Diffusivity, mm2/s 13
3.2
Thermal Shock Resistance, points 7.2
19

Alloy Composition

Aluminum (Al), % 0 to 0.0010
0
Antimony (Sb), % 0 to 0.1
0
Arsenic (As), % 0 to 0.030
0
Bismuth (Bi), % 56.5 to 59
0
Cadmium (Cd), % 0 to 0.0020
0
Carbon (C), % 0
0.35 to 0.45
Chromium (Cr), % 0
14 to 17
Copper (Cu), % 0 to 0.050
0 to 0.75
Gold (Au), % 0 to 0.050
0
Indium (In), % 0 to 0.1
0
Iron (Fe), % 0 to 0.020
40.5 to 51.7
Lead (Pb), % 0 to 0.070
0
Manganese (Mn), % 0
1.0 to 2.5
Molybdenum (Mo), % 0
0 to 0.75
Nickel (Ni), % 0 to 0.010
33 to 37
Phosphorus (P), % 0
0 to 0.040
Silicon (Si), % 0
0 to 1.0
Silver (Ag), % 0 to 0.1
0
Sulfur (S), % 0
0 to 0.030
Tin (Sn), % 41 to 43
0
Zinc (Zn), % 0 to 0.0010
0