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Solder Alloy 301 vs. Solder Alloy 601

Both solder alloy 301 and solder alloy 601 are otherwise unclassified metals. Both are furnished in the as-fabricated (no temper or treatment) condition. They have 42% of their average alloy composition in common. There are 21 material properties with values for both materials. Properties with values for just one material (6, in this case) are not shown.

For each property being compared, the top bar is solder alloy 301 and the bottom bar is solder alloy 601.

Metric UnitsUS Customary Units

Mechanical Properties

Brinell Hardness 23
5.0
Elastic (Young's, Tensile) Modulus, GPa 40
31
Elongation at Break, % 51
83
Poisson's Ratio 0.34
0.41
Shear Modulus, GPa 15
11
Tensile Strength: Ultimate (UTS), MPa 55
12

Thermal Properties

Latent Heat of Fusion, J/g 55
43
Melting Completion (Liquidus), °C 140
120
Melting Onset (Solidus), °C 140
120
Specific Heat Capacity, J/kg-K 160
230
Thermal Conductivity, W/m-K 19
34
Thermal Expansion, µm/m-K 14
23

Electrical Properties

Electrical Conductivity: Equal Volume, % IACS 4.7
12
Electrical Conductivity: Equal Weight (Specific), % IACS 4.9
14

Otherwise Unclassified Properties

Density, g/cm3 8.7
7.3

Common Calculations

Stiffness to Weight: Axial, points 2.5
2.3
Stiffness to Weight: Bending, points 13
14
Strength to Weight: Axial, points 1.8
0.45
Strength to Weight: Bending, points 3.7
1.6
Thermal Diffusivity, mm2/s 13
20
Thermal Shock Resistance, points 7.2
1.2

Alloy Composition

Aluminum (Al), % 0 to 0.0010
0 to 0.0010
Antimony (Sb), % 0 to 0.1
0 to 0.1
Arsenic (As), % 0 to 0.030
0 to 0.030
Bismuth (Bi), % 56.5 to 59
0 to 0.1
Cadmium (Cd), % 0 to 0.0020
0 to 0.0020
Copper (Cu), % 0 to 0.050
0 to 0.050
Gold (Au), % 0 to 0.050
0 to 0.050
Indium (In), % 0 to 0.1
51 to 52.5
Iron (Fe), % 0 to 0.020
0 to 0.020
Lead (Pb), % 0 to 0.070
0 to 0.070
Nickel (Ni), % 0 to 0.010
0 to 0.010
Silver (Ag), % 0 to 0.1
0 to 0.1
Tin (Sn), % 41 to 43
47.5 to 48.5
Zinc (Zn), % 0 to 0.0010
0 to 0.0010