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Solder Alloy 401 vs. Solder Alloy 191

Both solder alloy 401 and solder alloy 191 are otherwise unclassified metals. Both are furnished in the as-fabricated (no temper or treatment) condition. There are 22 material properties with values for both materials. Properties with values for just one material (2, in this case) are not shown.

For each property being compared, the top bar is solder alloy 401 and the bottom bar is solder alloy 191.

Metric UnitsUS Customary Units

Mechanical Properties

Elastic (Young's, Tensile) Modulus, GPa 50
19
Elongation at Break, % 21
32
Poisson's Ratio 0.36
0.43
Shear Modulus, GPa 19
6.5
Tensile Strength: Ultimate (UTS), MPa 29
29

Thermal Properties

Latent Heat of Fusion, J/g 60
27
Melting Completion (Liquidus), °C 230
300
Melting Onset (Solidus), °C 230
300
Specific Heat Capacity, J/kg-K 220
130
Thermal Conductivity, W/m-K 66
24
Thermal Expansion, µm/m-K 22
29

Electrical Properties

Electrical Conductivity: Equal Volume, % IACS 14
8.8
Electrical Conductivity: Equal Weight (Specific), % IACS 17
7.2

Otherwise Unclassified Properties

Density, g/cm3 7.3
11
Embodied Carbon, kg CO2/kg material 15
5.8
Embodied Energy, MJ/kg 250
95

Common Calculations

Stiffness to Weight: Axial, points 3.8
0.93
Stiffness to Weight: Bending, points 17
8.0
Strength to Weight: Axial, points 1.1
0.72
Strength to Weight: Bending, points 2.9
1.9
Thermal Diffusivity, mm2/s 40
16
Thermal Shock Resistance, points 1.9
3.9

Alloy Composition

Aluminum (Al), % 0 to 0.0010
0 to 0.0010
Antimony (Sb), % 0 to 0.1
0 to 0.2
Arsenic (As), % 0 to 0.030
0 to 0.030
Bismuth (Bi), % 0 to 0.1
0 to 0.1
Cadmium (Cd), % 0 to 0.0020
0 to 0.0020
Copper (Cu), % 0.5 to 0.9
0 to 0.080
Gold (Au), % 0 to 0.050
0 to 0.050
Indium (In), % 0 to 0.1
0 to 0.1
Iron (Fe), % 0 to 0.020
0 to 0.020
Lead (Pb), % 0 to 0.070
92.4 to 94
Nickel (Ni), % 0 to 0.010
0 to 0.010
Silver (Ag), % 0 to 0.1
1.2 to 1.8
Tin (Sn), % 98.5 to 99.5
4.8 to 5.2
Zinc (Zn), % 0 to 0.0010
0 to 0.0010