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Solder Alloy 401 vs. Solder Alloy 502

Both solder alloy 401 and solder alloy 502 are otherwise unclassified metals. Both are furnished in the as-fabricated (no temper or treatment) condition. They have a very high 96% of their average alloy composition in common. There are 22 material properties with values for both materials. Properties with values for just one material (2, in this case) are not shown.

For each property being compared, the top bar is solder alloy 401 and the bottom bar is solder alloy 502.

Metric UnitsUS Customary Units

Mechanical Properties

Elastic (Young's, Tensile) Modulus, GPa 50
53
Elongation at Break, % 21
34
Poisson's Ratio 0.36
0.36
Shear Modulus, GPa 19
19
Tensile Strength: Ultimate (UTS), MPa 29
58

Thermal Properties

Latent Heat of Fusion, J/g 60
66
Melting Completion (Liquidus), °C 230
350
Melting Onset (Solidus), °C 230
220
Specific Heat Capacity, J/kg-K 220
230
Thermal Conductivity, W/m-K 66
47
Thermal Expansion, µm/m-K 22
22

Electrical Properties

Electrical Conductivity: Equal Volume, % IACS 14
12
Electrical Conductivity: Equal Weight (Specific), % IACS 17
15

Otherwise Unclassified Properties

Density, g/cm3 7.3
7.4
Embodied Carbon, kg CO2/kg material 15
15
Embodied Energy, MJ/kg 250
260

Common Calculations

Stiffness to Weight: Axial, points 3.8
4.0
Stiffness to Weight: Bending, points 17
17
Strength to Weight: Axial, points 1.1
2.2
Strength to Weight: Bending, points 2.9
4.5
Thermal Diffusivity, mm2/s 40
28
Thermal Shock Resistance, points 1.9
3.6

Alloy Composition

Aluminum (Al), % 0 to 0.0010
0 to 0.0010
Antimony (Sb), % 0 to 0.1
0 to 0.1
Arsenic (As), % 0 to 0.030
0 to 0.030
Bismuth (Bi), % 0 to 0.1
0 to 0.080
Cadmium (Cd), % 0 to 0.0020
0 to 0.0020
Copper (Cu), % 0.5 to 0.9
3.5 to 4.5
Gold (Au), % 0 to 0.050
0 to 0.050
Indium (In), % 0 to 0.1
0 to 0.1
Iron (Fe), % 0 to 0.020
0 to 0.020
Lead (Pb), % 0 to 0.070
0 to 0.070
Nickel (Ni), % 0 to 0.010
0 to 0.010
Silver (Ag), % 0 to 0.1
0.8 to 1.2
Tin (Sn), % 98.5 to 99.5
93.8 to 95.7
Zinc (Zn), % 0 to 0.0010
0 to 0.0010