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Solder Alloy 401 vs. Nickel 200

Solder alloy 401 belongs to the otherwise unclassified metals classification, while nickel 200 belongs to the nickel alloys. There are 23 material properties with values for both materials. Properties with values for just one material (10, in this case) are not shown.

For each property being compared, the top bar is solder alloy 401 and the bottom bar is nickel 200.

Metric UnitsUS Customary Units

Mechanical Properties

Elastic (Young's, Tensile) Modulus, GPa 50
180
Elongation at Break, % 21
23 to 44
Poisson's Ratio 0.36
0.31
Shear Modulus, GPa 19
70
Tensile Strength: Ultimate (UTS), MPa 29
420 to 540

Thermal Properties

Latent Heat of Fusion, J/g 60
290
Melting Completion (Liquidus), °C 230
1460
Melting Onset (Solidus), °C 230
1440
Specific Heat Capacity, J/kg-K 220
450
Thermal Conductivity, W/m-K 66
69
Thermal Expansion, µm/m-K 22
13

Electrical Properties

Electrical Conductivity: Equal Volume, % IACS 14
18
Electrical Conductivity: Equal Weight (Specific), % IACS 17
18

Otherwise Unclassified Properties

Density, g/cm3 7.3
8.9
Embodied Carbon, kg CO2/kg material 15
11
Embodied Energy, MJ/kg 250
150
Embodied Water, L/kg 1200
230

Common Calculations

Stiffness to Weight: Axial, points 3.8
11
Stiffness to Weight: Bending, points 17
21
Strength to Weight: Axial, points 1.1
13 to 17
Strength to Weight: Bending, points 2.9
14 to 17
Thermal Diffusivity, mm2/s 40
17
Thermal Shock Resistance, points 1.9
13 to 16

Alloy Composition

Aluminum (Al), % 0 to 0.0010
0
Antimony (Sb), % 0 to 0.1
0
Arsenic (As), % 0 to 0.030
0
Bismuth (Bi), % 0 to 0.1
0
Cadmium (Cd), % 0 to 0.0020
0
Carbon (C), % 0
0 to 0.15
Copper (Cu), % 0.5 to 0.9
0 to 0.25
Gold (Au), % 0 to 0.050
0
Indium (In), % 0 to 0.1
0
Iron (Fe), % 0 to 0.020
0 to 0.4
Lead (Pb), % 0 to 0.070
0
Manganese (Mn), % 0
0 to 0.35
Nickel (Ni), % 0 to 0.010
99 to 100
Silicon (Si), % 0
0 to 0.35
Silver (Ag), % 0 to 0.1
0
Sulfur (S), % 0
0 to 0.010
Tin (Sn), % 98.5 to 99.5
0
Zinc (Zn), % 0 to 0.0010
0