Solder Alloy 401 vs. C49300 Brass
Solder alloy 401 belongs to the otherwise unclassified metals classification, while C49300 brass belongs to the copper alloys. There are 23 material properties with values for both materials. Properties with values for just one material (7, in this case) are not shown.
For each property being compared, the top bar is solder alloy 401 and the bottom bar is C49300 brass.
Metric UnitsUS Customary Units
Mechanical Properties
| Elastic (Young's, Tensile) Modulus, GPa | 50 | |
| 100 |
| Elongation at Break, % | 21 | |
| 4.5 to 20 |
| Poisson's Ratio | 0.36 | |
| 0.31 |
| Shear Modulus, GPa | 19 | |
| 40 |
| Tensile Strength: Ultimate (UTS), MPa | 29 | |
| 430 to 520 |
Thermal Properties
| Latent Heat of Fusion, J/g | 60 | |
| 170 |
| Melting Completion (Liquidus), °C | 230 | |
| 880 |
| Melting Onset (Solidus), °C | 230 | |
| 840 |
| Specific Heat Capacity, J/kg-K | 220 | |
| 380 |
| Thermal Conductivity, W/m-K | 66 | |
| 88 |
| Thermal Expansion, µm/m-K | 22 | |
| 20 |
Electrical Properties
| Electrical Conductivity: Equal Volume, % IACS | 14 | |
| 15 |
| Electrical Conductivity: Equal Weight (Specific), % IACS | 17 | |
| 17 |
Otherwise Unclassified Properties
| Density, g/cm3 | 7.3 | |
| 8.0 |
| Embodied Carbon, kg CO2/kg material | 15 | |
| 3.0 |
| Embodied Energy, MJ/kg | 250 | |
| 50 |
| Embodied Water, L/kg | 1200 | |
| 370 |
Common Calculations
| Stiffness to Weight: Axial, points | 3.8 | |
| 7.2 |
| Stiffness to Weight: Bending, points | 17 | |
| 19 |
| Strength to Weight: Axial, points | 1.1 | |
| 15 to 18 |
| Strength to Weight: Bending, points | 2.9 | |
| 16 to 18 |
| Thermal Diffusivity, mm2/s | 40 | |
| 29 |
| Thermal Shock Resistance, points | 1.9 | |
| 14 to 18 |
Alloy Composition
Deprecated: Automatic conversion of false to array is deprecated in /home/public/compare.php on line 460
| Aluminum (Al), % | 0 to 0.0010 | |
| 0 to 0.5 |
| Antimony (Sb), % | 0 to 0.1 | |
| 0 to 0.5 |
| Arsenic (As), % | 0 to 0.030 | |
| 0 |
| Bismuth (Bi), % | 0 to 0.1 | |
| 0.5 to 2.0 |
| Cadmium (Cd), % | 0 to 0.0020 | |
| 0 |
| Copper (Cu), % | 0.5 to 0.9 | |
| 58 to 62 |
| Gold (Au), % | 0 to 0.050 | |
| 0 |
| Indium (In), % | 0 to 0.1 | |
| 0 |
| Iron (Fe), % | 0 to 0.020 | |
| 0 to 0.1 |
| Lead (Pb), % | 0 to 0.070 | |
| 0 to 0.010 |
| Manganese (Mn), % | 0 | |
| 0 to 0.030 |
| Nickel (Ni), % | 0 to 0.010 | |
| 0 to 1.5 |
| Phosphorus (P), % | 0 | |
| 0 to 0.2 |
| Selenium (Se), % | 0 | |
| 0 to 0.2 |
| Silicon (Si), % | 0 | |
| 0 to 0.1 |
| Silver (Ag), % | 0 to 0.1 | |
| 0 |
| Tin (Sn), % | 98.5 to 99.5 | |
| 1.0 to 1.8 |
| Zinc (Zn), % | 0 to 0.0010 | |
| 30.6 to 40.5 |
| Residuals, % | 0 | |
| 0 to 0.5 |