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Solder Alloy 502 vs. Grade CU5MCuC Nickel

Solder alloy 502 belongs to the otherwise unclassified metals classification, while grade CU5MCuC nickel belongs to the nickel alloys. There are 18 material properties with values for both materials. Properties with values for just one material (12, in this case) are not shown.

For each property being compared, the top bar is solder alloy 502 and the bottom bar is grade CU5MCuC nickel.

Metric UnitsUS Customary Units

Mechanical Properties

Elastic (Young's, Tensile) Modulus, GPa 53
200
Elongation at Break, % 34
22
Poisson's Ratio 0.36
0.28
Shear Modulus, GPa 19
77
Tensile Strength: Ultimate (UTS), MPa 58
580

Thermal Properties

Latent Heat of Fusion, J/g 66
310
Melting Completion (Liquidus), °C 350
1420
Melting Onset (Solidus), °C 220
1370
Specific Heat Capacity, J/kg-K 230
460
Thermal Expansion, µm/m-K 22
13

Otherwise Unclassified Properties

Density, g/cm3 7.4
8.2
Embodied Carbon, kg CO2/kg material 15
7.7
Embodied Energy, MJ/kg 260
110

Common Calculations

Stiffness to Weight: Axial, points 4.0
13
Stiffness to Weight: Bending, points 17
24
Strength to Weight: Axial, points 2.2
20
Strength to Weight: Bending, points 4.5
19
Thermal Shock Resistance, points 3.6
16

Alloy Composition

Aluminum (Al), % 0 to 0.0010
0
Antimony (Sb), % 0 to 0.1
0
Arsenic (As), % 0 to 0.030
0
Bismuth (Bi), % 0 to 0.080
0
Cadmium (Cd), % 0 to 0.0020
0
Carbon (C), % 0
0 to 0.050
Chromium (Cr), % 0
19.5 to 23.5
Copper (Cu), % 3.5 to 4.5
1.5 to 3.5
Gold (Au), % 0 to 0.050
0
Indium (In), % 0 to 0.1
0
Iron (Fe), % 0 to 0.020
22.2 to 37.9
Lead (Pb), % 0 to 0.070
0
Manganese (Mn), % 0
0 to 1.0
Molybdenum (Mo), % 0
2.5 to 3.5
Nickel (Ni), % 0 to 0.010
38 to 44
Niobium (Nb), % 0
0.6 to 1.2
Phosphorus (P), % 0
0 to 0.030
Silicon (Si), % 0
0 to 1.0
Silver (Ag), % 0.8 to 1.2
0
Sulfur (S), % 0
0 to 0.030
Tin (Sn), % 93.8 to 95.7
0
Zinc (Zn), % 0 to 0.0010
0