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Solder Alloy 502 vs. Grade M30H Nickel

Solder alloy 502 belongs to the otherwise unclassified metals classification, while grade M30H nickel belongs to the nickel alloys. There are 22 material properties with values for both materials. Properties with values for just one material (7, in this case) are not shown.

For each property being compared, the top bar is solder alloy 502 and the bottom bar is grade M30H nickel.

Metric UnitsUS Customary Units

Mechanical Properties

Elastic (Young's, Tensile) Modulus, GPa 53
160
Elongation at Break, % 34
11
Poisson's Ratio 0.36
0.32
Shear Modulus, GPa 19
61
Tensile Strength: Ultimate (UTS), MPa 58
770

Thermal Properties

Latent Heat of Fusion, J/g 66
320
Melting Completion (Liquidus), °C 350
1250
Melting Onset (Solidus), °C 220
1200
Specific Heat Capacity, J/kg-K 230
440
Thermal Conductivity, W/m-K 47
22
Thermal Expansion, µm/m-K 22
13

Electrical Properties

Electrical Conductivity: Equal Volume, % IACS 12
3.3
Electrical Conductivity: Equal Weight (Specific), % IACS 15
3.4

Otherwise Unclassified Properties

Density, g/cm3 7.4
8.6
Embodied Carbon, kg CO2/kg material 15
7.7
Embodied Energy, MJ/kg 260
110

Common Calculations

Stiffness to Weight: Axial, points 4.0
10
Stiffness to Weight: Bending, points 17
21
Strength to Weight: Axial, points 2.2
25
Strength to Weight: Bending, points 4.5
22
Thermal Diffusivity, mm2/s 28
5.7
Thermal Shock Resistance, points 3.6
27

Alloy Composition

Aluminum (Al), % 0 to 0.0010
0
Antimony (Sb), % 0 to 0.1
0
Arsenic (As), % 0 to 0.030
0
Bismuth (Bi), % 0 to 0.080
0
Cadmium (Cd), % 0 to 0.0020
0
Carbon (C), % 0
0 to 0.3
Copper (Cu), % 3.5 to 4.5
27 to 33
Gold (Au), % 0 to 0.050
0
Indium (In), % 0 to 0.1
0
Iron (Fe), % 0 to 0.020
0 to 3.5
Lead (Pb), % 0 to 0.070
0
Manganese (Mn), % 0
0 to 1.5
Nickel (Ni), % 0 to 0.010
57.9 to 70.3
Phosphorus (P), % 0
0 to 0.030
Silicon (Si), % 0
2.7 to 3.7
Silver (Ag), % 0.8 to 1.2
0
Sulfur (S), % 0
0 to 0.030
Tin (Sn), % 93.8 to 95.7
0
Zinc (Zn), % 0 to 0.0010
0