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Solder Alloy 503 vs. C70600 Copper-nickel

Solder alloy 503 belongs to the otherwise unclassified metals classification, while C70600 copper-nickel belongs to the copper alloys. There are 22 material properties with values for both materials. Properties with values for just one material (8, in this case) are not shown.

For each property being compared, the top bar is solder alloy 503 and the bottom bar is C70600 copper-nickel.

Metric UnitsUS Customary Units

Mechanical Properties

Elastic (Young's, Tensile) Modulus, GPa 54
120
Elongation at Break, % 30
3.0 to 34
Poisson's Ratio 0.36
0.34
Shear Modulus, GPa 20
46
Tensile Strength: Ultimate (UTS), MPa 57
290 to 570

Thermal Properties

Latent Heat of Fusion, J/g 69
220
Melting Completion (Liquidus), °C 380
1150
Melting Onset (Solidus), °C 220
1100
Specific Heat Capacity, J/kg-K 230
390
Thermal Conductivity, W/m-K 61
44
Thermal Expansion, µm/m-K 22
17

Electrical Properties

Electrical Conductivity: Equal Volume, % IACS 14
9.8
Electrical Conductivity: Equal Weight (Specific), % IACS 17
9.9

Otherwise Unclassified Properties

Density, g/cm3 7.5
8.9
Embodied Carbon, kg CO2/kg material 16
3.4
Embodied Energy, MJ/kg 270
51

Common Calculations

Stiffness to Weight: Axial, points 4.1
7.7
Stiffness to Weight: Bending, points 17
19
Strength to Weight: Axial, points 2.1
9.1 to 18
Strength to Weight: Bending, points 4.4
11 to 17
Thermal Diffusivity, mm2/s 35
13
Thermal Shock Resistance, points 3.5
9.8 to 19

Alloy Composition

Aluminum (Al), % 0 to 0.0010
0
Antimony (Sb), % 0 to 0.1
0
Arsenic (As), % 0 to 0.030
0
Bismuth (Bi), % 0 to 0.080
0
Cadmium (Cd), % 0 to 0.0020
0
Copper (Cu), % 5.5 to 6.5
84.7 to 90
Gold (Au), % 0 to 0.050
0
Indium (In), % 0 to 0.1
0
Iron (Fe), % 0 to 0.020
1.0 to 1.8
Lead (Pb), % 0 to 0.070
0 to 0.050
Manganese (Mn), % 0
0 to 1.0
Nickel (Ni), % 0 to 0.010
9.0 to 11
Silver (Ag), % 1.8 to 2.2
0
Tin (Sn), % 90.8 to 92.7
0
Zinc (Zn), % 0 to 0.0010
0 to 1.0
Residuals, % 0
0 to 0.5