Solder Alloy 601 vs. 2219 Aluminum
Solder alloy 601 belongs to the otherwise unclassified metals classification, while 2219 aluminum belongs to the aluminum alloys. There are 21 material properties with values for both materials. Properties with values for just one material (10, in this case) are not shown. Please note that the two materials have significantly dissimilar densities. This means that additional care is required when interpreting the data, because some material properties are based on units of mass, while others are based on units of area or volume.
For each property being compared, the top bar is solder alloy 601 and the bottom bar is 2219 aluminum.
Metric UnitsUS Customary Units
Mechanical Properties
| Elastic (Young's, Tensile) Modulus, GPa | 31 | |
| 72 |
| Elongation at Break, % | 83 | |
| 2.2 to 20 |
| Poisson's Ratio | 0.41 | |
| 0.33 |
| Shear Modulus, GPa | 11 | |
| 27 |
| Tensile Strength: Ultimate (UTS), MPa | 12 | |
| 180 to 480 |
Thermal Properties
| Latent Heat of Fusion, J/g | 43 | |
| 390 |
| Melting Completion (Liquidus), °C | 120 | |
| 640 |
| Melting Onset (Solidus), °C | 120 | |
| 540 |
| Specific Heat Capacity, J/kg-K | 230 | |
| 870 |
| Thermal Conductivity, W/m-K | 34 | |
| 110 to 170 |
| Thermal Expansion, µm/m-K | 23 | |
| 22 |
Electrical Properties
| Electrical Conductivity: Equal Volume, % IACS | 12 | |
| 28 to 44 |
| Electrical Conductivity: Equal Weight (Specific), % IACS | 14 | |
| 81 to 130 |
Otherwise Unclassified Properties
| Density, g/cm3 | 7.3 | |
| 3.1 |
| Embodied Water, L/kg | 1330 | |
| 1130 |
Common Calculations
| Stiffness to Weight: Axial, points | 2.3 | |
| 13 |
| Stiffness to Weight: Bending, points | 14 | |
| 44 |
| Strength to Weight: Axial, points | 0.45 | |
| 16 to 43 |
| Strength to Weight: Bending, points | 1.6 | |
| 23 to 44 |
| Thermal Diffusivity, mm2/s | 20 | |
| 42 to 63 |
| Thermal Shock Resistance, points | 1.2 | |
| 8.2 to 22 |
Alloy Composition
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| Aluminum (Al), % | 0 to 0.0010 | |
| 91.5 to 93.8 |
| Antimony (Sb), % | 0 to 0.1 | |
| 0 |
| Arsenic (As), % | 0 to 0.030 | |
| 0 |
| Bismuth (Bi), % | 0 to 0.1 | |
| 0 |
| Cadmium (Cd), % | 0 to 0.0020 | |
| 0 |
| Copper (Cu), % | 0 to 0.050 | |
| 5.8 to 6.8 |
| Gold (Au), % | 0 to 0.050 | |
| 0 |
| Indium (In), % | 51 to 52.5 | |
| 0 |
| Iron (Fe), % | 0 to 0.020 | |
| 0 to 0.3 |
| Lead (Pb), % | 0 to 0.070 | |
| 0 |
| Magnesium (Mg), % | 0 | |
| 0 to 0.020 |
| Manganese (Mn), % | 0 | |
| 0.2 to 0.4 |
| Nickel (Ni), % | 0 to 0.010 | |
| 0 |
| Silicon (Si), % | 0 | |
| 0 to 0.2 |
| Silver (Ag), % | 0 to 0.1 | |
| 0 |
| Tin (Sn), % | 47.5 to 48.5 | |
| 0 |
| Titanium (Ti), % | 0 | |
| 0.020 to 0.1 |
| Vanadium (V), % | 0 | |
| 0.050 to 0.15 |
| Zinc (Zn), % | 0 to 0.0010 | |
| 0 to 0.1 |
| Zirconium (Zr), % | 0 | |
| 0.1 to 0.25 |
| Residuals, % | 0 | |
| 0 to 0.15 |