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Solder Alloy 601 vs. Solder Alloy 104

Both solder alloy 601 and solder alloy 104 are otherwise unclassified metals. Both are furnished in the as-fabricated (no temper or treatment) condition. They have 48% of their average alloy composition in common. There are 21 material properties with values for both materials. Properties with values for just one material (3, in this case) are not shown.

For each property being compared, the top bar is solder alloy 601 and the bottom bar is solder alloy 104.

Metric UnitsUS Customary Units

Mechanical Properties

Elastic (Young's, Tensile) Modulus, GPa 31
37
Elongation at Break, % 83
46
Poisson's Ratio 0.41
0.39
Shear Modulus, GPa 11
13
Tensile Strength: Ultimate (UTS), MPa 12
51

Thermal Properties

Latent Heat of Fusion, J/g 43
45
Melting Completion (Liquidus), °C 120
190
Melting Onset (Solidus), °C 120
180
Specific Heat Capacity, J/kg-K 230
180
Thermal Conductivity, W/m-K 34
50
Thermal Expansion, µm/m-K 23
25

Electrical Properties

Electrical Conductivity: Equal Volume, % IACS 12
11
Electrical Conductivity: Equal Weight (Specific), % IACS 14
11

Otherwise Unclassified Properties

Density, g/cm3 7.3
8.9
Embodied Water, L/kg 1330
900

Common Calculations

Stiffness to Weight: Axial, points 2.3
2.3
Stiffness to Weight: Bending, points 14
12
Strength to Weight: Axial, points 0.45
1.6
Strength to Weight: Bending, points 1.6
3.4
Thermal Diffusivity, mm2/s 20
30
Thermal Shock Resistance, points 1.2
4.0

Alloy Composition

Aluminum (Al), % 0 to 0.0010
0 to 0.0010
Antimony (Sb), % 0 to 0.1
0 to 0.050
Arsenic (As), % 0 to 0.030
0 to 0.030
Bismuth (Bi), % 0 to 0.1
0 to 0.050
Cadmium (Cd), % 0 to 0.0020
0 to 0.0020
Copper (Cu), % 0 to 0.050
0 to 0.080
Gold (Au), % 0 to 0.050
0 to 0.050
Indium (In), % 51 to 52.5
0 to 0.1
Iron (Fe), % 0 to 0.020
0 to 0.020
Lead (Pb), % 0 to 0.070
39 to 40.5
Nickel (Ni), % 0 to 0.010
0 to 0.010
Silver (Ag), % 0 to 0.1
0 to 0.1
Tin (Sn), % 47.5 to 48.5
59.5 to 60.5
Zinc (Zn), % 0 to 0.0010
0 to 0.0010