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Solder Alloy 601 vs. Solder Alloy 715

Both solder alloy 601 and solder alloy 715 are otherwise unclassified metals. Both are furnished in the as-fabricated (no temper or treatment) condition. They have 48% of their average alloy composition in common. There are 21 material properties with values for both materials. Properties with values for just one material (3, in this case) are not shown.

For each property being compared, the top bar is solder alloy 601 and the bottom bar is solder alloy 715.

Metric UnitsUS Customary Units

Mechanical Properties

Brinell Hardness 5.0
16
Elastic (Young's, Tensile) Modulus, GPa 31
51
Elongation at Break, % 83
21
Poisson's Ratio 0.41
0.36
Shear Modulus, GPa 11
19
Tensile Strength: Ultimate (UTS), MPa 12
30

Thermal Properties

Latent Heat of Fusion, J/g 43
61
Melting Completion (Liquidus), °C 120
220
Melting Onset (Solidus), °C 120
220
Specific Heat Capacity, J/kg-K 230
220
Thermal Conductivity, W/m-K 34
60
Thermal Expansion, µm/m-K 23
22

Electrical Properties

Electrical Conductivity: Equal Volume, % IACS 12
12
Electrical Conductivity: Equal Weight (Specific), % IACS 14
15

Otherwise Unclassified Properties

Density, g/cm3 7.3
7.3

Common Calculations

Stiffness to Weight: Axial, points 2.3
3.8
Stiffness to Weight: Bending, points 14
17
Strength to Weight: Axial, points 0.45
1.1
Strength to Weight: Bending, points 1.6
2.9
Thermal Diffusivity, mm2/s 20
37
Thermal Shock Resistance, points 1.2
1.9

Alloy Composition

Aluminum (Al), % 0 to 0.0010
0 to 0.0010
Antimony (Sb), % 0 to 0.1
0 to 0.1
Arsenic (As), % 0 to 0.030
0 to 0.030
Bismuth (Bi), % 0 to 0.1
0 to 0.1
Cadmium (Cd), % 0 to 0.0020
0 to 0.0020
Copper (Cu), % 0 to 0.050
0.5 to 0.9
Gold (Au), % 0 to 0.050
0 to 0.050
Indium (In), % 51 to 52.5
0 to 0.1
Iron (Fe), % 0 to 0.020
0 to 0.020
Lead (Pb), % 0 to 0.070
0 to 0.070
Nickel (Ni), % 0 to 0.010
0 to 0.010
Silver (Ag), % 0 to 0.1
0.8 to 1.2
Tin (Sn), % 47.5 to 48.5
97.4 to 98.7
Zinc (Zn), % 0 to 0.0010
0 to 0.0010