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Solder Alloy 702 vs. Solder Alloy 123

Both solder alloy 702 and solder alloy 123 are otherwise unclassified metals. Both are furnished in the as-fabricated (no temper or treatment) condition. There are 22 material properties with values for both materials. Properties with values for just one material (3, in this case) are not shown.

For each property being compared, the top bar is solder alloy 702 and the bottom bar is solder alloy 123.

Metric UnitsUS Customary Units

Mechanical Properties

Elastic (Young's, Tensile) Modulus, GPa 51
18
Elongation at Break, % 21
45
Poisson's Ratio 0.36
0.44
Shear Modulus, GPa 19
6.2
Tensile Strength: Ultimate (UTS), MPa 53
28

Thermal Properties

Latent Heat of Fusion, J/g 61
26
Melting Completion (Liquidus), °C 220
310
Melting Onset (Solidus), °C 220
300
Specific Heat Capacity, J/kg-K 220
130
Thermal Conductivity, W/m-K 62
23
Thermal Expansion, µm/m-K 22
29

Electrical Properties

Electrical Conductivity: Equal Volume, % IACS 15
8.8
Electrical Conductivity: Equal Weight (Specific), % IACS 18
7.1

Otherwise Unclassified Properties

Density, g/cm3 7.4
11
Embodied Carbon, kg CO2/kg material 17
4.5
Embodied Energy, MJ/kg 290
74

Common Calculations

Stiffness to Weight: Axial, points 3.8
0.9
Stiffness to Weight: Bending, points 17
7.8
Strength to Weight: Axial, points 2.0
0.69
Strength to Weight: Bending, points 4.2
1.8
Thermal Diffusivity, mm2/s 38
16
Thermal Shock Resistance, points 3.4
3.8

Alloy Composition

Aluminum (Al), % 0 to 0.0010
0 to 0.0010
Antimony (Sb), % 0 to 0.1
0 to 0.5
Arsenic (As), % 0 to 0.030
0 to 0.030
Bismuth (Bi), % 0 to 0.1
0 to 0.1
Cadmium (Cd), % 0 to 0.0020
0 to 0.0050
Copper (Cu), % 0 to 0.050
0 to 0.080
Gold (Au), % 0 to 0.050
0 to 0.050
Indium (In), % 0 to 0.1
0 to 0.1
Iron (Fe), % 0 to 0.020
0 to 0.020
Lead (Pb), % 0 to 0.070
93.5 to 95.5
Nickel (Ni), % 0 to 0.010
0 to 0.010
Silver (Ag), % 2.8 to 3.2
0 to 0.1
Tin (Sn), % 96.3 to 97.2
4.5 to 5.5
Zinc (Zn), % 0 to 0.0010
0 to 0.0010