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Solder Alloy 703 vs. AWS E330H

Solder alloy 703 belongs to the otherwise unclassified metals classification, while AWS E330H belongs to the iron alloys. There are 22 material properties with values for both materials. Properties with values for just one material (4, in this case) are not shown.

For each property being compared, the top bar is solder alloy 703 and the bottom bar is AWS E330H.

Metric UnitsUS Customary Units

Mechanical Properties

Elastic (Young's, Tensile) Modulus, GPa 51
190
Elongation at Break, % 35
11
Poisson's Ratio 0.36
0.29
Shear Modulus, GPa 19
76
Tensile Strength: Ultimate (UTS), MPa 57
690

Thermal Properties

Latent Heat of Fusion, J/g 61
290
Melting Completion (Liquidus), °C 220
1400
Melting Onset (Solidus), °C 220
1350
Specific Heat Capacity, J/kg-K 220
470
Thermal Conductivity, W/m-K 55
12
Thermal Expansion, µm/m-K 22
13

Electrical Properties

Electrical Conductivity: Equal Volume, % IACS 14
1.7
Electrical Conductivity: Equal Weight (Specific), % IACS 17
1.9

Otherwise Unclassified Properties

Density, g/cm3 7.4
8.1
Embodied Carbon, kg CO2/kg material 18
5.4
Embodied Energy, MJ/kg 300
76

Common Calculations

Stiffness to Weight: Axial, points 3.8
13
Stiffness to Weight: Bending, points 17
24
Strength to Weight: Axial, points 2.1
24
Strength to Weight: Bending, points 4.4
22
Thermal Diffusivity, mm2/s 33
3.2
Thermal Shock Resistance, points 3.7
19

Alloy Composition

Aluminum (Al), % 0 to 0.0010
0
Antimony (Sb), % 0 to 0.1
0
Arsenic (As), % 0 to 0.030
0
Bismuth (Bi), % 0 to 0.1
0
Cadmium (Cd), % 0 to 0.0020
0
Carbon (C), % 0
0.35 to 0.45
Chromium (Cr), % 0
14 to 17
Copper (Cu), % 0 to 0.050
0 to 0.75
Gold (Au), % 0 to 0.050
0
Indium (In), % 0 to 0.1
0
Iron (Fe), % 0 to 0.020
40.5 to 51.7
Lead (Pb), % 0 to 0.070
0
Manganese (Mn), % 0
1.0 to 2.5
Molybdenum (Mo), % 0
0 to 0.75
Nickel (Ni), % 0 to 0.010
33 to 37
Phosphorus (P), % 0
0 to 0.040
Silicon (Si), % 0
0 to 1.0
Silver (Ag), % 3.3 to 3.7
0
Sulfur (S), % 0
0 to 0.030
Tin (Sn), % 95.8 to 96.7
0
Zinc (Zn), % 0 to 0.0010
0