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Solder Alloy 703 vs. Solder Alloy 601

Both solder alloy 703 and solder alloy 601 are otherwise unclassified metals. Both are furnished in the as-fabricated (no temper or treatment) condition. They have 48% of their average alloy composition in common. There are 21 material properties with values for both materials. Properties with values for just one material (3, in this case) are not shown.

For each property being compared, the top bar is solder alloy 703 and the bottom bar is solder alloy 601.

Metric UnitsUS Customary Units

Mechanical Properties

Brinell Hardness 15
5.0
Elastic (Young's, Tensile) Modulus, GPa 51
31
Elongation at Break, % 35
83
Poisson's Ratio 0.36
0.41
Shear Modulus, GPa 19
11
Tensile Strength: Ultimate (UTS), MPa 57
12

Thermal Properties

Latent Heat of Fusion, J/g 61
43
Melting Completion (Liquidus), °C 220
120
Melting Onset (Solidus), °C 220
120
Specific Heat Capacity, J/kg-K 220
230
Thermal Conductivity, W/m-K 55
34
Thermal Expansion, µm/m-K 22
23

Electrical Properties

Electrical Conductivity: Equal Volume, % IACS 14
12
Electrical Conductivity: Equal Weight (Specific), % IACS 17
14

Otherwise Unclassified Properties

Density, g/cm3 7.4
7.3

Common Calculations

Stiffness to Weight: Axial, points 3.8
2.3
Stiffness to Weight: Bending, points 17
14
Strength to Weight: Axial, points 2.1
0.45
Strength to Weight: Bending, points 4.4
1.6
Thermal Diffusivity, mm2/s 33
20
Thermal Shock Resistance, points 3.7
1.2

Alloy Composition

Aluminum (Al), % 0 to 0.0010
0 to 0.0010
Antimony (Sb), % 0 to 0.1
0 to 0.1
Arsenic (As), % 0 to 0.030
0 to 0.030
Bismuth (Bi), % 0 to 0.1
0 to 0.1
Cadmium (Cd), % 0 to 0.0020
0 to 0.0020
Copper (Cu), % 0 to 0.050
0 to 0.050
Gold (Au), % 0 to 0.050
0 to 0.050
Indium (In), % 0 to 0.1
51 to 52.5
Iron (Fe), % 0 to 0.020
0 to 0.020
Lead (Pb), % 0 to 0.070
0 to 0.070
Nickel (Ni), % 0 to 0.010
0 to 0.010
Silver (Ag), % 3.3 to 3.7
0 to 0.1
Tin (Sn), % 95.8 to 96.7
47.5 to 48.5
Zinc (Zn), % 0 to 0.0010
0 to 0.0010