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Solder Alloy 703 vs. C18200 Copper

Solder alloy 703 belongs to the otherwise unclassified metals classification, while C18200 copper belongs to the copper alloys. There are 22 material properties with values for both materials. Properties with values for just one material (9, in this case) are not shown.

For each property being compared, the top bar is solder alloy 703 and the bottom bar is C18200 copper.

Metric UnitsUS Customary Units

Mechanical Properties

Elastic (Young's, Tensile) Modulus, GPa 51
120
Elongation at Break, % 35
11 to 40
Poisson's Ratio 0.36
0.34
Shear Modulus, GPa 19
44
Tensile Strength: Ultimate (UTS), MPa 57
310 to 530

Thermal Properties

Latent Heat of Fusion, J/g 61
210
Melting Completion (Liquidus), °C 220
1080
Melting Onset (Solidus), °C 220
1070
Specific Heat Capacity, J/kg-K 220
390
Thermal Conductivity, W/m-K 55
320
Thermal Expansion, µm/m-K 22
18

Electrical Properties

Electrical Conductivity: Equal Volume, % IACS 14
80
Electrical Conductivity: Equal Weight (Specific), % IACS 17
81

Otherwise Unclassified Properties

Density, g/cm3 7.4
8.9
Embodied Carbon, kg CO2/kg material 18
2.6
Embodied Energy, MJ/kg 300
41

Common Calculations

Stiffness to Weight: Axial, points 3.8
7.3
Stiffness to Weight: Bending, points 17
18
Strength to Weight: Axial, points 2.1
9.6 to 16
Strength to Weight: Bending, points 4.4
11 to 16
Thermal Diffusivity, mm2/s 33
93
Thermal Shock Resistance, points 3.7
11 to 18

Alloy Composition

Aluminum (Al), % 0 to 0.0010
0
Antimony (Sb), % 0 to 0.1
0
Arsenic (As), % 0 to 0.030
0
Bismuth (Bi), % 0 to 0.1
0
Cadmium (Cd), % 0 to 0.0020
0
Chromium (Cr), % 0
0.6 to 1.2
Copper (Cu), % 0 to 0.050
98.6 to 99.4
Gold (Au), % 0 to 0.050
0
Indium (In), % 0 to 0.1
0
Iron (Fe), % 0 to 0.020
0 to 0.1
Lead (Pb), % 0 to 0.070
0 to 0.050
Nickel (Ni), % 0 to 0.010
0
Silicon (Si), % 0
0 to 0.1
Silver (Ag), % 3.3 to 3.7
0
Tin (Sn), % 95.8 to 96.7
0
Zinc (Zn), % 0 to 0.0010
0