Solder Alloy 703 vs. C96600 Copper
Solder alloy 703 belongs to the otherwise unclassified metals classification, while C96600 copper belongs to the copper alloys. There are 22 material properties with values for both materials. Properties with values for just one material (7, in this case) are not shown.
For each property being compared, the top bar is solder alloy 703 and the bottom bar is C96600 copper.
Metric UnitsUS Customary Units
Mechanical Properties
| Elastic (Young's, Tensile) Modulus, GPa | 51 | |
| 140 |
| Elongation at Break, % | 35 | |
| 7.0 |
| Poisson's Ratio | 0.36 | |
| 0.33 |
| Shear Modulus, GPa | 19 | |
| 52 |
| Tensile Strength: Ultimate (UTS), MPa | 57 | |
| 760 |
Thermal Properties
| Latent Heat of Fusion, J/g | 61 | |
| 240 |
| Melting Completion (Liquidus), °C | 220 | |
| 1180 |
| Melting Onset (Solidus), °C | 220 | |
| 1100 |
| Specific Heat Capacity, J/kg-K | 220 | |
| 400 |
| Thermal Conductivity, W/m-K | 55 | |
| 30 |
| Thermal Expansion, µm/m-K | 22 | |
| 15 |
Electrical Properties
| Electrical Conductivity: Equal Volume, % IACS | 14 | |
| 4.0 |
| Electrical Conductivity: Equal Weight (Specific), % IACS | 17 | |
| 4.1 |
Otherwise Unclassified Properties
| Density, g/cm3 | 7.4 | |
| 8.9 |
| Embodied Carbon, kg CO2/kg material | 18 | |
| 7.0 |
| Embodied Energy, MJ/kg | 300 | |
| 100 |
Common Calculations
| Stiffness to Weight: Axial, points | 3.8 | |
| 8.7 |
| Stiffness to Weight: Bending, points | 17 | |
| 20 |
| Strength to Weight: Axial, points | 2.1 | |
| 24 |
| Strength to Weight: Bending, points | 4.4 | |
| 21 |
| Thermal Diffusivity, mm2/s | 33 | |
| 8.4 |
| Thermal Shock Resistance, points | 3.7 | |
| 25 |
Alloy Composition
Deprecated: Automatic conversion of false to array is deprecated in /home/public/compare.php on line 460
| Aluminum (Al), % | 0 to 0.0010 | |
| 0 |
| Antimony (Sb), % | 0 to 0.1 | |
| 0 |
| Arsenic (As), % | 0 to 0.030 | |
| 0 |
| Beryllium (Be), % | 0 | |
| 0.4 to 0.7 |
| Bismuth (Bi), % | 0 to 0.1 | |
| 0 |
| Cadmium (Cd), % | 0 to 0.0020 | |
| 0 |
| Copper (Cu), % | 0 to 0.050 | |
| 63.5 to 69.8 |
| Gold (Au), % | 0 to 0.050 | |
| 0 |
| Indium (In), % | 0 to 0.1 | |
| 0 |
| Iron (Fe), % | 0 to 0.020 | |
| 0.8 to 1.1 |
| Lead (Pb), % | 0 to 0.070 | |
| 0 to 0.010 |
| Manganese (Mn), % | 0 | |
| 0 to 1.0 |
| Nickel (Ni), % | 0 to 0.010 | |
| 29 to 33 |
| Silicon (Si), % | 0 | |
| 0 to 0.15 |
| Silver (Ag), % | 3.3 to 3.7 | |
| 0 |
| Tin (Sn), % | 95.8 to 96.7 | |
| 0 |
| Zinc (Zn), % | 0 to 0.0010 | |
| 0 |
| Residuals, % | 0 | |
| 0 to 0.5 |