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Solder Alloy 721 vs. C96900 Copper-nickel

Solder alloy 721 belongs to the otherwise unclassified metals classification, while C96900 copper-nickel belongs to the copper alloys. There are 20 material properties with values for both materials. Properties with values for just one material (8, in this case) are not shown.

For each property being compared, the top bar is solder alloy 721 and the bottom bar is C96900 copper-nickel.

Metric UnitsUS Customary Units

Mechanical Properties

Elastic (Young's, Tensile) Modulus, GPa 51
120
Elongation at Break, % 17
4.5
Poisson's Ratio 0.36
0.34
Shear Modulus, GPa 19
45
Tensile Strength: Ultimate (UTS), MPa 50
850

Thermal Properties

Latent Heat of Fusion, J/g 61
210
Melting Completion (Liquidus), °C 220
1060
Melting Onset (Solidus), °C 210
960
Specific Heat Capacity, J/kg-K 220
380
Thermal Expansion, µm/m-K 22
17

Electrical Properties

Electrical Conductivity: Equal Volume, % IACS 14
9.0
Electrical Conductivity: Equal Weight (Specific), % IACS 17
9.2

Otherwise Unclassified Properties

Density, g/cm3 7.4
8.8
Embodied Carbon, kg CO2/kg material 17
4.6
Embodied Energy, MJ/kg 280
72

Common Calculations

Stiffness to Weight: Axial, points 3.8
7.7
Stiffness to Weight: Bending, points 17
19
Strength to Weight: Axial, points 1.9
27
Strength to Weight: Bending, points 4.1
23
Thermal Shock Resistance, points 3.2
30

Alloy Composition

Aluminum (Al), % 0 to 0.0010
0
Antimony (Sb), % 0 to 0.1
0
Arsenic (As), % 0 to 0.030
0
Bismuth (Bi), % 0.8 to 1.2
0
Cadmium (Cd), % 0 to 0.0020
0
Copper (Cu), % 0.3 to 0.7
73.6 to 78
Gold (Au), % 0 to 0.050
0
Indium (In), % 0 to 0.1
0
Iron (Fe), % 0 to 0.020
0 to 0.5
Lead (Pb), % 0 to 0.070
0 to 0.020
Magnesium (Mg), % 0
0 to 0.15
Manganese (Mn), % 0
0.050 to 0.3
Nickel (Ni), % 0 to 0.010
14.5 to 15.5
Niobium (Nb), % 0
0 to 0.1
Silicon (Si), % 0
0 to 0.3
Silver (Ag), % 2.3 to 2.7
0
Tin (Sn), % 95 to 96.6
7.5 to 8.5
Zinc (Zn), % 0 to 0.0010
0 to 0.5
Residuals, % 0
0 to 0.5