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Solder Alloy 801 vs. Solder Alloy 401

Both solder alloy 801 and solder alloy 401 are otherwise unclassified metals. Both are furnished in the as-fabricated (no temper or treatment) condition. They have a moderately high 91% of their average alloy composition in common.

For each property being compared, the top bar is solder alloy 801 and the bottom bar is solder alloy 401.

Metric UnitsUS Customary Units

Mechanical Properties

Brinell Hardness 22
9.0
Elastic (Young's, Tensile) Modulus, GPa 53
50
Elongation at Break, % 33
21
Poisson's Ratio 0.35
0.36
Shear Modulus, GPa 20
19
Tensile Strength: Ultimate (UTS), MPa 55
29

Thermal Properties

Latent Heat of Fusion, J/g 64
60
Melting Completion (Liquidus), °C 200
230
Melting Onset (Solidus), °C 200
230
Specific Heat Capacity, J/kg-K 240
220
Thermal Conductivity, W/m-K 61
66
Thermal Expansion, µm/m-K 22
22

Electrical Properties

Electrical Conductivity: Equal Volume, % IACS 15
14
Electrical Conductivity: Equal Weight (Specific), % IACS 19
17

Otherwise Unclassified Properties

Density, g/cm3 7.2
7.3
Embodied Carbon, kg CO2/kg material 14
15
Embodied Energy, MJ/kg 240
250
Embodied Water, L/kg 1140
1200

Common Calculations

Stiffness to Weight: Axial, points 4.1
3.8
Stiffness to Weight: Bending, points 17
17
Strength to Weight: Axial, points 2.1
1.1
Strength to Weight: Bending, points 4.4
2.9
Thermal Diffusivity, mm2/s 36
40
Thermal Shock Resistance, points 3.3
1.9

Alloy Composition

Aluminum (Al), % 0 to 0.0010
0 to 0.0010
Antimony (Sb), % 0 to 0.1
0 to 0.1
Arsenic (As), % 0 to 0.030
0 to 0.030
Bismuth (Bi), % 0 to 0.1
0 to 0.1
Cadmium (Cd), % 0 to 0.0020
0 to 0.0020
Copper (Cu), % 0 to 0.050
0.5 to 0.9
Gold (Au), % 0 to 0.050
0 to 0.050
Indium (In), % 0 to 0.1
0 to 0.1
Iron (Fe), % 0 to 0.020
0 to 0.020
Lead (Pb), % 0 to 0.070
0 to 0.070
Nickel (Ni), % 0 to 0.010
0 to 0.010
Silver (Ag), % 0 to 0.1
0 to 0.1
Tin (Sn), % 89.9 to 91.5
98.5 to 99.5
Zinc (Zn), % 8.5 to 9.5
0 to 0.0010