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Solder Alloy 801 vs. C16500 Copper

Solder alloy 801 belongs to the otherwise unclassified metals classification, while C16500 copper belongs to the copper alloys. There are 23 material properties with values for both materials. Properties with values for just one material (8, in this case) are not shown.

For each property being compared, the top bar is solder alloy 801 and the bottom bar is C16500 copper.

Metric UnitsUS Customary Units

Mechanical Properties

Elastic (Young's, Tensile) Modulus, GPa 53
110
Elongation at Break, % 33
1.5 to 53
Poisson's Ratio 0.35
0.34
Shear Modulus, GPa 20
43
Tensile Strength: Ultimate (UTS), MPa 55
280 to 530

Thermal Properties

Latent Heat of Fusion, J/g 64
210
Melting Completion (Liquidus), °C 200
1070
Melting Onset (Solidus), °C 200
1010
Specific Heat Capacity, J/kg-K 240
380
Thermal Conductivity, W/m-K 61
250
Thermal Expansion, µm/m-K 22
17

Electrical Properties

Electrical Conductivity: Equal Volume, % IACS 15
60
Electrical Conductivity: Equal Weight (Specific), % IACS 19
61

Otherwise Unclassified Properties

Density, g/cm3 7.2
8.9
Embodied Carbon, kg CO2/kg material 14
2.6
Embodied Energy, MJ/kg 240
42
Embodied Water, L/kg 1140
320

Common Calculations

Stiffness to Weight: Axial, points 4.1
7.1
Stiffness to Weight: Bending, points 17
18
Strength to Weight: Axial, points 2.1
8.6 to 17
Strength to Weight: Bending, points 4.4
11 to 16
Thermal Diffusivity, mm2/s 36
74
Thermal Shock Resistance, points 3.3
9.8 to 19

Alloy Composition


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Aluminum (Al), % 0 to 0.0010
0
Antimony (Sb), % 0 to 0.1
0
Arsenic (As), % 0 to 0.030
0
Bismuth (Bi), % 0 to 0.1
0
Cadmium (Cd), % 0 to 0.0020
0.6 to 1.0
Copper (Cu), % 0 to 0.050
97.8 to 98.9
Gold (Au), % 0 to 0.050
0
Indium (In), % 0 to 0.1
0
Iron (Fe), % 0 to 0.020
0 to 0.020
Lead (Pb), % 0 to 0.070
0
Nickel (Ni), % 0 to 0.010
0
Silver (Ag), % 0 to 0.1
0
Tin (Sn), % 89.9 to 91.5
0.5 to 0.7
Zinc (Zn), % 8.5 to 9.5
0
Residuals, % 0
0 to 0.5