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Solder Alloy 801 vs. C75700 Nickel Silver

Solder alloy 801 belongs to the otherwise unclassified metals classification, while C75700 nickel silver belongs to the copper alloys. There are 23 material properties with values for both materials. Properties with values for just one material (7, in this case) are not shown.

For each property being compared, the top bar is solder alloy 801 and the bottom bar is C75700 nickel silver.

Metric UnitsUS Customary Units

Mechanical Properties

Elastic (Young's, Tensile) Modulus, GPa 53
120
Elongation at Break, % 33
3.2 to 22
Poisson's Ratio 0.35
0.32
Shear Modulus, GPa 20
45
Tensile Strength: Ultimate (UTS), MPa 55
590 to 610

Thermal Properties

Latent Heat of Fusion, J/g 64
200
Melting Completion (Liquidus), °C 200
1040
Melting Onset (Solidus), °C 200
990
Specific Heat Capacity, J/kg-K 240
390
Thermal Conductivity, W/m-K 61
40
Thermal Expansion, µm/m-K 22
16

Electrical Properties

Electrical Conductivity: Equal Volume, % IACS 15
8.0
Electrical Conductivity: Equal Weight (Specific), % IACS 19
8.6

Otherwise Unclassified Properties

Density, g/cm3 7.2
8.4
Embodied Carbon, kg CO2/kg material 14
3.6
Embodied Energy, MJ/kg 240
56
Embodied Water, L/kg 1140
310

Common Calculations

Stiffness to Weight: Axial, points 4.1
7.8
Stiffness to Weight: Bending, points 17
19
Strength to Weight: Axial, points 2.1
19 to 20
Strength to Weight: Bending, points 4.4
19
Thermal Diffusivity, mm2/s 36
12
Thermal Shock Resistance, points 3.3
22 to 23

Alloy Composition


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Aluminum (Al), % 0 to 0.0010
0
Antimony (Sb), % 0 to 0.1
0
Arsenic (As), % 0 to 0.030
0
Bismuth (Bi), % 0 to 0.1
0
Cadmium (Cd), % 0 to 0.0020
0
Copper (Cu), % 0 to 0.050
63.5 to 66.5
Gold (Au), % 0 to 0.050
0
Indium (In), % 0 to 0.1
0
Iron (Fe), % 0 to 0.020
0 to 0.25
Lead (Pb), % 0 to 0.070
0 to 0.050
Manganese (Mn), % 0
0 to 0.5
Nickel (Ni), % 0 to 0.010
11 to 13
Silver (Ag), % 0 to 0.1
0
Tin (Sn), % 89.9 to 91.5
0
Zinc (Zn), % 8.5 to 9.5
19.2 to 25.5
Residuals, % 0
0 to 0.5