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H55 C10300 Copper vs. H55 C72200 Copper-nickel

Both H55 C10300 copper and H55 C72200 copper-nickel are copper alloys. Both are furnished in the H55 (light drawn) temper. They have 81% of their average alloy composition in common. There are 26 material properties with values for both materials. Properties with values for just one material (3, in this case) are not shown.

For each property being compared, the top bar is H55 C10300 copper and the bottom bar is H55 C72200 copper-nickel.

Metric UnitsUS Customary Units

Mechanical Properties

Elastic (Young's, Tensile) Modulus, GPa 120
130
Poisson's Ratio 0.34
0.33
Shear Modulus, GPa 43
48
Tensile Strength: Ultimate (UTS), MPa 290
390
Tensile Strength: Yield (Proof), MPa 230
350

Thermal Properties

Latent Heat of Fusion, J/g 210
220
Maximum Temperature: Mechanical, °C 200
230
Melting Completion (Liquidus), °C 1080
1180
Melting Onset (Solidus), °C 1080
1120
Specific Heat Capacity, J/kg-K 390
400
Thermal Conductivity, W/m-K 390
34
Thermal Expansion, µm/m-K 17
16

Electrical Properties

Electrical Conductivity: Equal Volume, % IACS 99
6.5
Electrical Conductivity: Equal Weight (Specific), % IACS 99
6.6

Otherwise Unclassified Properties

Base Metal Price, % relative 31
36
Density, g/cm3 9.0
8.9
Embodied Carbon, kg CO2/kg material 2.6
3.9
Embodied Energy, MJ/kg 41
59
Embodied Water, L/kg 310
300

Common Calculations

Resilience: Unit (Modulus of Resilience), kJ/m3 230
490
Stiffness to Weight: Axial, points 7.2
8.0
Stiffness to Weight: Bending, points 18
19
Strength to Weight: Axial, points 8.8
12
Strength to Weight: Bending, points 11
13
Thermal Diffusivity, mm2/s 110
9.6
Thermal Shock Resistance, points 10
13

Alloy Composition


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Chromium (Cr), % 0
0.3 to 0.7
Copper (Cu), % 99.95 to 99.999
78.1 to 84.2
Iron (Fe), % 0
0.5 to 1.0
Lead (Pb), % 0
0 to 0.050
Manganese (Mn), % 0
0 to 1.0
Nickel (Ni), % 0
15 to 18
Phosphorus (P), % 0.0010 to 0.0050
0
Zinc (Zn), % 0
0 to 1.0
Residuals, % 0
0 to 0.2