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H55 C10800 Copper vs. H55 C12000 Copper

Both H55 C10800 copper and H55 C12000 copper are copper alloys. Both are furnished in the H55 (light drawn) temper. Their average alloy composition is basically identical. There are 29 material properties with values for both materials. Properties with values for just one material (3, in this case) are not shown.

For each property being compared, the top bar is H55 C10800 copper and the bottom bar is H55 C12000 copper.

Metric UnitsUS Customary Units

Mechanical Properties

Elastic (Young's, Tensile) Modulus, GPa 120
120
Elongation at Break, % 25
27
Poisson's Ratio 0.34
0.34
Shear Modulus, GPa 43
43
Shear Strength, MPa 180
180
Tensile Strength: Ultimate (UTS), MPa 280
290
Tensile Strength: Yield (Proof), MPa 230
230

Thermal Properties

Latent Heat of Fusion, J/g 210
210
Maximum Temperature: Mechanical, °C 200
200
Melting Completion (Liquidus), °C 1080
1080
Melting Onset (Solidus), °C 1080
1080
Specific Heat Capacity, J/kg-K 390
390
Thermal Conductivity, W/m-K 350
390
Thermal Expansion, µm/m-K 17
17

Electrical Properties

Electrical Conductivity: Equal Volume, % IACS 92
98
Electrical Conductivity: Equal Weight (Specific), % IACS 92
98

Otherwise Unclassified Properties

Base Metal Price, % relative 31
31
Density, g/cm3 9.0
9.0
Embodied Carbon, kg CO2/kg material 2.6
2.6
Embodied Energy, MJ/kg 41
41
Embodied Water, L/kg 310
310

Common Calculations

Resilience: Ultimate (Unit Rupture Work), MJ/m3 66
71
Resilience: Unit (Modulus of Resilience), kJ/m3 240
230
Stiffness to Weight: Axial, points 7.2
7.2
Stiffness to Weight: Bending, points 18
18
Strength to Weight: Axial, points 8.7
8.8
Strength to Weight: Bending, points 11
11
Thermal Diffusivity, mm2/s 100
110
Thermal Shock Resistance, points 9.9
10

Alloy Composition

Copper (Cu), % 99.95 to 99.995
99.9 to 99.996
Phosphorus (P), % 0.0050 to 0.012
0.0040 to 0.012