Melamine Moulding Compound vs. Thermoset PI
Both melamine moulding compound and thermoset PI are thermoset plastics. There are 5 material properties with values for both materials. Properties with values for just one material (20, in this case) are not shown.
For each property being compared, the top bar is melamine moulding compound and the bottom bar is thermoset PI.
Metric UnitsUS Customary Units
Material Properties
| Density, g/cm3 | 1.3 to 1.9 | |
| 1.4 to 1.6 |
| Dielectric Strength (Breakdown Potential), kV/mm | 4.4 to 11 | |
| 20 |
| Flexural Strength, MPa | 45 to 160 | |
| 60 to 100 |
| Heat Deflection Temperature At 1.82 MPa (264 psi), °C | 170 to 230 | |
| 370 |
| Water Absorption After 24 Hours, % | 0.13 to 0.53 | |
| 0.14 to 0.24 |