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Nickel 200 vs. C17510 Copper

Nickel 200 belongs to the nickel alloys classification, while C17510 copper belongs to the copper alloys. There are 29 material properties with values for both materials. Properties with values for just one material (4, in this case) are not shown.

For each property being compared, the top bar is nickel 200 and the bottom bar is C17510 copper.

Metric UnitsUS Customary Units

Mechanical Properties

Elastic (Young's, Tensile) Modulus, GPa 180
120
Elongation at Break, % 23 to 44
5.4 to 37
Poisson's Ratio 0.31
0.34
Shear Modulus, GPa 70
44
Shear Strength, MPa 300 to 340
210 to 500
Tensile Strength: Ultimate (UTS), MPa 420 to 540
310 to 860
Tensile Strength: Yield (Proof), MPa 120 to 370
120 to 750

Thermal Properties

Latent Heat of Fusion, J/g 290
220
Maximum Temperature: Mechanical, °C 900
220
Melting Completion (Liquidus), °C 1460
1070
Melting Onset (Solidus), °C 1440
1030
Specific Heat Capacity, J/kg-K 450
390
Thermal Conductivity, W/m-K 69
210
Thermal Expansion, µm/m-K 13
17

Electrical Properties

Electrical Conductivity: Equal Volume, % IACS 18
22 to 54
Electrical Conductivity: Equal Weight (Specific), % IACS 18
23 to 54

Otherwise Unclassified Properties

Base Metal Price, % relative 65
49
Density, g/cm3 8.9
8.9
Embodied Carbon, kg CO2/kg material 11
4.2
Embodied Energy, MJ/kg 150
65
Embodied Water, L/kg 230
310

Common Calculations

Resilience: Ultimate (Unit Rupture Work), MJ/m3 110 to 150
39 to 92
Resilience: Unit (Modulus of Resilience), kJ/m3 42 to 370
64 to 2410
Stiffness to Weight: Axial, points 11
7.4
Stiffness to Weight: Bending, points 21
18
Strength to Weight: Axial, points 13 to 17
9.7 to 27
Strength to Weight: Bending, points 14 to 17
11 to 23
Thermal Diffusivity, mm2/s 17
60
Thermal Shock Resistance, points 13 to 16
11 to 30

Alloy Composition


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Aluminum (Al), % 0
0 to 0.2
Beryllium (Be), % 0
0.2 to 0.6
Carbon (C), % 0 to 0.15
0
Cobalt (Co), % 0
0 to 0.3
Copper (Cu), % 0 to 0.25
95.9 to 98.4
Iron (Fe), % 0 to 0.4
0 to 0.1
Manganese (Mn), % 0 to 0.35
0
Nickel (Ni), % 99 to 100
1.4 to 2.2
Silicon (Si), % 0 to 0.35
0 to 0.2
Sulfur (S), % 0 to 0.010
0
Residuals, % 0
0 to 0.5