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Nickel 201 vs. Solder Alloy 801

Nickel 201 belongs to the nickel alloys classification, while solder alloy 801 belongs to the otherwise unclassified metals. There are 23 material properties with values for both materials. Properties with values for just one material (9, in this case) are not shown.

For each property being compared, the top bar is nickel 201 and the bottom bar is solder alloy 801.

Metric UnitsUS Customary Units

Mechanical Properties

Elastic (Young's, Tensile) Modulus, GPa 180
53
Elongation at Break, % 4.5 to 45
33
Poisson's Ratio 0.31
0.35
Shear Modulus, GPa 70
20
Tensile Strength: Ultimate (UTS), MPa 390 to 660
55

Thermal Properties

Latent Heat of Fusion, J/g 290
64
Melting Completion (Liquidus), °C 1450
200
Melting Onset (Solidus), °C 1440
200
Specific Heat Capacity, J/kg-K 440
240
Thermal Conductivity, W/m-K 78
61
Thermal Expansion, µm/m-K 13
22

Electrical Properties

Electrical Conductivity: Equal Volume, % IACS 19
15
Electrical Conductivity: Equal Weight (Specific), % IACS 19
19

Otherwise Unclassified Properties

Density, g/cm3 8.9
7.2
Embodied Carbon, kg CO2/kg material 11
14
Embodied Energy, MJ/kg 150
240
Embodied Water, L/kg 230
1140

Common Calculations

Stiffness to Weight: Axial, points 11
4.1
Stiffness to Weight: Bending, points 21
17
Strength to Weight: Axial, points 12 to 20
2.1
Strength to Weight: Bending, points 13 to 19
4.4
Thermal Diffusivity, mm2/s 20
36
Thermal Shock Resistance, points 11 to 19
3.3

Alloy Composition

Aluminum (Al), % 0
0 to 0.0010
Antimony (Sb), % 0
0 to 0.1
Arsenic (As), % 0
0 to 0.030
Bismuth (Bi), % 0
0 to 0.1
Cadmium (Cd), % 0
0 to 0.0020
Carbon (C), % 0 to 0.020
0
Copper (Cu), % 0 to 0.25
0 to 0.050
Gold (Au), % 0
0 to 0.050
Indium (In), % 0
0 to 0.1
Iron (Fe), % 0 to 0.4
0 to 0.020
Lead (Pb), % 0
0 to 0.070
Manganese (Mn), % 0 to 0.35
0
Nickel (Ni), % 99 to 100
0 to 0.010
Silicon (Si), % 0 to 0.35
0
Silver (Ag), % 0
0 to 0.1
Sulfur (S), % 0 to 0.010
0
Tin (Sn), % 0
89.9 to 91.5
Zinc (Zn), % 0
8.5 to 9.5