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Hot Pressed Boron Carbide vs. Hot Pressed Silicon Nitride

Both hot pressed boron carbide and hot pressed silicon nitride are non-oxide engineering ceramics. Both are furnished in the hot isostatic pressed (HIP) condition. There are 20 material properties with values for both materials. Properties with values for just one material (2, in this case) are not shown.

For each property being compared, the top bar is hot pressed boron carbide and the bottom bar is hot pressed silicon nitride.

Metric UnitsUS Customary Units

Mechanical Properties

Compressive (Crushing) Strength, MPa 2200
2810
Elastic (Young's, Tensile) Modulus, GPa 460
310
Flexural Strength, MPa 410
810
Fracture Toughness, MPa-m1/2 2.5
6.2
Knoop Hardness 3200
1570
Poisson's Ratio 0.17
0.27
Tensile Strength: Ultimate (UTS), MPa 350
510

Thermal Properties

Maximum Temperature: Mechanical, °C 2000
1330
Specific Heat Capacity, J/kg-K 950
720
Thermal Conductivity, W/m-K 90
31
Thermal Expansion, µm/m-K 5.6
3.2

Electrical Properties

Dielectric Constant (Relative Permittivity) At 1 MHz 6.4
8.2
Electrical Resistivity Order of Magnitude, 10x Ω-m 0
12

Otherwise Unclassified Properties

Density, g/cm3 2.5
3.2

Common Calculations

Stiffness to Weight: Axial, points 100
53
Stiffness to Weight: Bending, points 100
69
Strength to Weight: Axial, points 39
44
Strength to Weight: Bending, points 44
44
Thermal Diffusivity, mm2/s 38
13
Thermal Shock Resistance, points 9.7
37