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H01 C12200 Copper vs. H01 C73500 Nickel Silver

Both H01 C12200 copper and H01 C73500 nickel silver are copper alloys. Both are furnished in the H01 (quarter hard) temper. They have 72% of their average alloy composition in common. There are 25 material properties with values for both materials. Properties with values for just one material (7, in this case) are not shown.

For each property being compared, the top bar is H01 C12200 copper and the bottom bar is H01 C73500 nickel silver.

Metric UnitsUS Customary Units

Mechanical Properties

Elastic (Young's, Tensile) Modulus, GPa 120
130
Poisson's Ratio 0.34
0.33
Rockwell Superficial 30T Hardness 35
65
Shear Modulus, GPa 43
47
Tensile Strength: Ultimate (UTS), MPa 270
430

Thermal Properties

Latent Heat of Fusion, J/g 210
210
Maximum Temperature: Mechanical, °C 200
220
Melting Completion (Liquidus), °C 1080
1140
Melting Onset (Solidus), °C 1030
1090
Specific Heat Capacity, J/kg-K 390
400
Thermal Conductivity, W/m-K 340
36
Thermal Expansion, µm/m-K 17
17

Electrical Properties

Electrical Conductivity: Equal Volume, % IACS 85
6.5
Electrical Conductivity: Equal Weight (Specific), % IACS 85
6.7

Otherwise Unclassified Properties

Base Metal Price, % relative 31
35
Density, g/cm3 9.0
8.7
Embodied Carbon, kg CO2/kg material 2.6
4.0
Embodied Energy, MJ/kg 41
61
Embodied Water, L/kg 310
300

Common Calculations

Stiffness to Weight: Axial, points 7.2
8.0
Stiffness to Weight: Bending, points 18
19
Strength to Weight: Axial, points 8.2
14
Strength to Weight: Bending, points 10
15
Thermal Diffusivity, mm2/s 98
10
Thermal Shock Resistance, points 9.5
14

Alloy Composition


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Copper (Cu), % 99.9 to 99.985
70.5 to 73.5
Iron (Fe), % 0
0 to 0.25
Lead (Pb), % 0
0 to 0.1
Manganese (Mn), % 0
0 to 0.5
Nickel (Ni), % 0
16.5 to 19.5
Phosphorus (P), % 0.015 to 0.040
0
Zinc (Zn), % 0
5.7 to 13
Residuals, % 0
0 to 0.5