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H08 C10500 Copper vs. H08 C12500 Copper

Both H08 C10500 copper and H08 C12500 copper are copper alloys. Both are furnished in the H08 (spring) temper. Their average alloy composition is basically identical.

For each property being compared, the top bar is H08 C10500 copper and the bottom bar is H08 C12500 copper.

Metric UnitsUS Customary Units

Mechanical Properties

Elastic (Young's, Tensile) Modulus, GPa 120
120
Elongation at Break, % 2.8
1.9
Poisson's Ratio 0.34
0.34
Rockwell B Hardness 60
60
Rockwell F Hardness 94
94
Rockwell Superficial 30T Hardness 63
63
Shear Modulus, GPa 43
43
Shear Strength, MPa 210
210
Tensile Strength: Ultimate (UTS), MPa 390
420
Tensile Strength: Yield (Proof), MPa 370
380

Thermal Properties

Latent Heat of Fusion, J/g 210
210
Maximum Temperature: Mechanical, °C 200
200
Melting Completion (Liquidus), °C 1080
1080
Melting Onset (Solidus), °C 1080
1070
Specific Heat Capacity, J/kg-K 390
390
Thermal Conductivity, W/m-K 390
350
Thermal Expansion, µm/m-K 17
17

Electrical Properties

Electrical Conductivity: Equal Volume, % IACS 100
92
Electrical Conductivity: Equal Weight (Specific), % IACS 100
93

Otherwise Unclassified Properties

Base Metal Price, % relative 32
31
Density, g/cm3 9.0
8.9
Embodied Carbon, kg CO2/kg material 2.6
2.6
Embodied Energy, MJ/kg 42
41
Embodied Water, L/kg 350
310

Common Calculations

Resilience: Ultimate (Unit Rupture Work), MJ/m3 11
7.7
Resilience: Unit (Modulus of Resilience), kJ/m3 600
610
Stiffness to Weight: Axial, points 7.2
7.2
Stiffness to Weight: Bending, points 18
18
Strength to Weight: Axial, points 12
13
Strength to Weight: Bending, points 13
14
Thermal Diffusivity, mm2/s 110
100
Thermal Shock Resistance, points 14
15

Alloy Composition


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Antimony (Sb), % 0
0 to 0.0030
Arsenic (As), % 0
0 to 0.012
Bismuth (Bi), % 0
0 to 0.0030
Copper (Cu), % 99.89 to 99.966
99.88 to 100
Lead (Pb), % 0
0 to 0.0040
Nickel (Ni), % 0
0 to 0.050
Oxygen (O), % 0 to 0.0010
0
Silver (Ag), % 0.034 to 0.060
0
Tellurium (Te), % 0
0 to 0.025
Residuals, % 0 to 0.050
0 to 0.3