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H08 C12900 Copper vs. H08 C75200 Nickel Silver

Both H08 C12900 copper and H08 C75200 nickel silver are copper alloys. Both are furnished in the H08 (spring) temper. They have 65% of their average alloy composition in common. There are 26 material properties with values for both materials. Properties with values for just one material (6, in this case) are not shown.

For each property being compared, the top bar is H08 C12900 copper and the bottom bar is H08 C75200 nickel silver.

Metric UnitsUS Customary Units

Mechanical Properties

Elastic (Young's, Tensile) Modulus, GPa 120
120
Poisson's Ratio 0.34
0.32
Rockwell B Hardness 60
93
Rockwell Superficial 30T Hardness 63
78
Shear Modulus, GPa 43
47
Tensile Strength: Ultimate (UTS), MPa 420
660

Thermal Properties

Latent Heat of Fusion, J/g 210
210
Maximum Temperature: Mechanical, °C 200
200
Melting Completion (Liquidus), °C 1080
1110
Melting Onset (Solidus), °C 1030
1070
Specific Heat Capacity, J/kg-K 390
400
Thermal Conductivity, W/m-K 380
33
Thermal Expansion, µm/m-K 17
18

Electrical Properties

Electrical Conductivity: Equal Volume, % IACS 98
6.0
Electrical Conductivity: Equal Weight (Specific), % IACS 98
6.3

Otherwise Unclassified Properties

Base Metal Price, % relative 32
33
Density, g/cm3 9.0
8.5
Embodied Carbon, kg CO2/kg material 2.6
4.1
Embodied Energy, MJ/kg 41
62
Embodied Water, L/kg 330
300

Common Calculations

Stiffness to Weight: Axial, points 7.2
8.0
Stiffness to Weight: Bending, points 18
19
Strength to Weight: Axial, points 13
21
Strength to Weight: Bending, points 14
20
Thermal Diffusivity, mm2/s 110
9.8
Thermal Shock Resistance, points 15
22

Alloy Composition


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Antimony (Sb), % 0 to 0.0030
0
Arsenic (As), % 0 to 0.012
0
Bismuth (Bi), % 0 to 0.0030
0
Copper (Cu), % 99.88 to 100
63.5 to 66.5
Iron (Fe), % 0
0 to 0.25
Lead (Pb), % 0 to 0.0040
0 to 0.050
Manganese (Mn), % 0
0 to 0.5
Nickel (Ni), % 0 to 0.050
16.5 to 19.5
Silver (Ag), % 0 to 0.054
0
Tellurium (Te), % 0 to 0.025
0
Zinc (Zn), % 0
12.7 to 20
Residuals, % 0
0 to 0.5