H08 C72800 Copper-nickel vs. H08 C74500 Nickel Silver
Both H08 C72800 copper-nickel and H08 C74500 nickel silver are copper alloys. Both are furnished in the H08 (spring) temper. They have 76% of their average alloy composition in common. There are 26 material properties with values for both materials. Properties with values for just one material (6, in this case) are not shown.
For each property being compared, the top bar is H08 C72800 copper-nickel and the bottom bar is H08 C74500 nickel silver.
Metric UnitsUS Customary Units
Mechanical Properties
| Elastic (Young's, Tensile) Modulus, GPa | 120 | |
| 120 |
| Poisson's Ratio | 0.34 | |
| 0.32 |
| Shear Modulus, GPa | 44 | |
| 44 |
| Tensile Strength: Ultimate (UTS), MPa | 960 | |
| 700 |
Thermal Properties
| Latent Heat of Fusion, J/g | 210 | |
| 190 |
| Maximum Temperature: Mechanical, °C | 200 | |
| 170 |
| Melting Completion (Liquidus), °C | 1080 | |
| 1020 |
| Melting Onset (Solidus), °C | 920 | |
| 970 |
| Specific Heat Capacity, J/kg-K | 380 | |
| 390 |
| Thermal Conductivity, W/m-K | 55 | |
| 45 |
| Thermal Expansion, µm/m-K | 17 | |
| 19 |
Electrical Properties
| Electrical Conductivity: Equal Volume, % IACS | 11 | |
| 9.0 |
| Electrical Conductivity: Equal Weight (Specific), % IACS | 11 | |
| 9.7 |
Otherwise Unclassified Properties
| Base Metal Price, % relative | 38 | |
| 29 |
| Density, g/cm3 | 8.8 | |
| 8.3 |
| Embodied Carbon, kg CO2/kg material | 4.4 | |
| 3.4 |
| Embodied Energy, MJ/kg | 68 | |
| 54 |
| Embodied Water, L/kg | 360 | |
| 310 |
Common Calculations
| Resilience: Ultimate (Unit Rupture Work), MJ/m3 | 37 | |
| 12 to 160 |
| Resilience: Unit (Modulus of Resilience), kJ/m3 | 3530 | |
| 620 to 1540 |
| Stiffness to Weight: Axial, points | 7.4 | |
| 7.7 |
| Stiffness to Weight: Bending, points | 19 | |
| 19 |
| Strength to Weight: Axial, points | 30 | |
| 23 |
| Strength to Weight: Bending, points | 25 | |
| 21 |
| Thermal Diffusivity, mm2/s | 17 | |
| 14 |
| Thermal Shock Resistance, points | 34 | |
| 23 |
Alloy Composition
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| Aluminum (Al), % | 0 to 0.1 | |
| 0 |
| Antimony (Sb), % | 0 to 0.020 | |
| 0 |
| Bismuth (Bi), % | 0 to 0.0010 | |
| 0 |
| Boron (B), % | 0 to 0.0010 | |
| 0 |
| Copper (Cu), % | 78.3 to 82.8 | |
| 63.5 to 66.5 |
| Iron (Fe), % | 0 to 0.5 | |
| 0 to 0.25 |
| Lead (Pb), % | 0 to 0.0050 | |
| 0 to 0.1 |
| Magnesium (Mg), % | 0.0050 to 0.15 | |
| 0 |
| Manganese (Mn), % | 0.050 to 0.3 | |
| 0 to 0.5 |
| Nickel (Ni), % | 9.5 to 10.5 | |
| 9.0 to 11 |
| Niobium (Nb), % | 0.1 to 0.3 | |
| 0 |
| Phosphorus (P), % | 0 to 0.0050 | |
| 0 |
| Silicon (Si), % | 0 to 0.050 | |
| 0 |
| Sulfur (S), % | 0 to 0.0025 | |
| 0 |
| Tin (Sn), % | 7.5 to 8.5 | |
| 0 |
| Titanium (Ti), % | 0 to 0.010 | |
| 0 |
| Zinc (Zn), % | 0 to 1.0 | |
| 21.2 to 27.5 |
| Residuals, % | 0 to 0.3 | |
| 0 to 0.5 |