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TD04 C17000 Copper vs. TD04 C17200 Copper

Both TD04 C17000 copper and TD04 C17200 copper are copper alloys. Both are furnished in the TD04 (solution heat treated and cold worked to full-hard) temper. Their average alloy composition is basically identical. There are 30 material properties with values for both materials. Properties with values for just one material (1, in this case) are not shown.

For each property being compared, the top bar is TD04 C17000 copper and the bottom bar is TD04 C17200 copper.

Metric UnitsUS Customary Units

Mechanical Properties

Elastic (Young's, Tensile) Modulus, GPa 120
120
Elongation at Break, % 7.7
8.1
Poisson's Ratio 0.33
0.33
Rockwell B Hardness 96
97
Rockwell Superficial 30T Hardness 79
79
Shear Modulus, GPa 45
45
Shear Strength, MPa 440
440
Tensile Strength: Ultimate (UTS), MPa 750
750
Tensile Strength: Yield (Proof), MPa 590
620

Thermal Properties

Latent Heat of Fusion, J/g 230
230
Maximum Temperature: Mechanical, °C 270
280
Melting Completion (Liquidus), °C 980
980
Melting Onset (Solidus), °C 870
870
Specific Heat Capacity, J/kg-K 390
390
Thermal Conductivity, W/m-K 110
110
Thermal Expansion, µm/m-K 17
18

Electrical Properties

Electrical Conductivity: Equal Volume, % IACS 22
22
Electrical Conductivity: Equal Weight (Specific), % IACS 22
23

Otherwise Unclassified Properties

Density, g/cm3 8.8
8.8
Embodied Carbon, kg CO2/kg material 8.7
9.4
Embodied Energy, MJ/kg 140
150
Embodied Water, L/kg 310
310

Common Calculations

Resilience: Ultimate (Unit Rupture Work), MJ/m3 54
57
Resilience: Unit (Modulus of Resilience), kJ/m3 1460
1610
Stiffness to Weight: Axial, points 7.6
7.6
Stiffness to Weight: Bending, points 19
19
Strength to Weight: Axial, points 24
24
Strength to Weight: Bending, points 21
21
Thermal Diffusivity, mm2/s 32
31
Thermal Shock Resistance, points 26
25

Alloy Composition


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Aluminum (Al), % 0 to 0.2
0 to 0.2
Beryllium (Be), % 1.6 to 1.8
1.8 to 2.0
Copper (Cu), % 96.3 to 98.2
96.1 to 98
Iron (Fe), % 0 to 0.4
0 to 0.4
Nickel (Ni), % 0.2 to 0.6
0.2 to 0.6
Silicon (Si), % 0 to 0.2
0 to 0.2
Residuals, % 0 to 0.5
0 to 0.5