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TH01 C17200 Copper vs. TH01 C72800 Copper-nickel

Both TH01 C17200 copper and TH01 C72800 copper-nickel are copper alloys. Both are furnished in the TH01 (quarter-hard and precipitation heat treated) temper. They have 81% of their average alloy composition in common. There are 28 material properties with values for both materials. Properties with values for just one material (2, in this case) are not shown.

For each property being compared, the top bar is TH01 C17200 copper and the bottom bar is TH01 C72800 copper-nickel.

Metric UnitsUS Customary Units

Mechanical Properties

Elastic (Young's, Tensile) Modulus, GPa 120
120
Elongation at Break, % 2.8
5.9
Poisson's Ratio 0.33
0.34
Rockwell C Hardness 41
37
Shear Modulus, GPa 45
44
Shear Strength, MPa 750
740
Tensile Strength: Ultimate (UTS), MPa 1310
1270
Tensile Strength: Yield (Proof), MPa 1170
1210

Thermal Properties

Latent Heat of Fusion, J/g 230
210
Maximum Temperature: Mechanical, °C 280
200
Melting Completion (Liquidus), °C 980
1080
Melting Onset (Solidus), °C 870
920
Specific Heat Capacity, J/kg-K 390
380
Thermal Conductivity, W/m-K 110
55
Thermal Expansion, µm/m-K 18
17

Electrical Properties

Electrical Conductivity: Equal Volume, % IACS 22
11
Electrical Conductivity: Equal Weight (Specific), % IACS 23
11

Otherwise Unclassified Properties

Density, g/cm3 8.8
8.8
Embodied Carbon, kg CO2/kg material 9.4
4.4
Embodied Energy, MJ/kg 150
68
Embodied Water, L/kg 310
360

Common Calculations

Resilience: Ultimate (Unit Rupture Work), MJ/m3 35
73
Stiffness to Weight: Axial, points 7.6
7.4
Stiffness to Weight: Bending, points 19
19
Strength to Weight: Axial, points 41
40
Strength to Weight: Bending, points 30
30
Thermal Diffusivity, mm2/s 31
17
Thermal Shock Resistance, points 44
45

Alloy Composition


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Aluminum (Al), % 0 to 0.2
0 to 0.1
Antimony (Sb), % 0
0 to 0.020
Beryllium (Be), % 1.8 to 2.0
0
Bismuth (Bi), % 0
0 to 0.0010
Boron (B), % 0
0 to 0.0010
Copper (Cu), % 96.1 to 98
78.3 to 82.8
Iron (Fe), % 0 to 0.4
0 to 0.5
Lead (Pb), % 0
0 to 0.0050
Magnesium (Mg), % 0
0.0050 to 0.15
Manganese (Mn), % 0
0.050 to 0.3
Nickel (Ni), % 0.2 to 0.6
9.5 to 10.5
Niobium (Nb), % 0
0.1 to 0.3
Phosphorus (P), % 0
0 to 0.0050
Silicon (Si), % 0 to 0.2
0 to 0.050
Sulfur (S), % 0
0 to 0.0025
Tin (Sn), % 0
7.5 to 8.5
Titanium (Ti), % 0
0 to 0.010
Zinc (Zn), % 0
0 to 1.0
Residuals, % 0 to 0.5
0 to 0.3