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C10200 Copper vs. Solder Alloy 112

C10200 copper belongs to the copper alloys classification, while solder alloy 112 belongs to the otherwise unclassified metals. There are 23 material properties with values for both materials. Properties with values for just one material (8, in this case) are not shown.

For each property being compared, the top bar is C10200 copper and the bottom bar is solder alloy 112.

Metric UnitsUS Customary Units

Mechanical Properties

Elastic (Young's, Tensile) Modulus, GPa 120
33
Elongation at Break, % 2.6 to 50
35
Poisson's Ratio 0.34
0.4
Shear Modulus, GPa 43
12
Tensile Strength: Ultimate (UTS), MPa 230 to 410
41

Thermal Properties

Latent Heat of Fusion, J/g 210
41
Melting Completion (Liquidus), °C 1080
220
Melting Onset (Solidus), °C 1080
180
Specific Heat Capacity, J/kg-K 390
180
Thermal Conductivity, W/m-K 390
49
Thermal Expansion, µm/m-K 17
26

Electrical Properties

Electrical Conductivity: Equal Volume, % IACS 100
11
Electrical Conductivity: Equal Weight (Specific), % IACS 100
10

Otherwise Unclassified Properties

Density, g/cm3 9.0
9.3
Embodied Carbon, kg CO2/kg material 2.6
9.4
Embodied Energy, MJ/kg 41
160
Embodied Water, L/kg 310
830

Common Calculations

Stiffness to Weight: Axial, points 7.2
2.0
Stiffness to Weight: Bending, points 18
11
Strength to Weight: Axial, points 7.2 to 13
1.2
Strength to Weight: Bending, points 9.4 to 14
2.8
Thermal Diffusivity, mm2/s 110
30
Thermal Shock Resistance, points 8.2 to 15
3.5

Alloy Composition

Aluminum (Al), % 0
0 to 0.0010
Antimony (Sb), % 0
0 to 0.050
Arsenic (As), % 0
0 to 0.030
Bismuth (Bi), % 0
0 to 0.050
Cadmium (Cd), % 0
0 to 0.0020
Copper (Cu), % 99.95 to 100
0 to 0.080
Gold (Au), % 0
0 to 0.050
Indium (In), % 0
0 to 0.1
Iron (Fe), % 0
0 to 0.020
Lead (Pb), % 0
49 to 50.5
Nickel (Ni), % 0
0 to 0.010
Oxygen (O), % 0 to 0.0010
0
Silver (Ag), % 0
0 to 0.1
Tin (Sn), % 0
49.5 to 50.5
Zinc (Zn), % 0
0 to 0.0010