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C10300 Copper vs. EN 1.4507 Stainless Steel

C10300 copper belongs to the copper alloys classification, while EN 1.4507 stainless steel belongs to the iron alloys. There are 29 material properties with values for both materials. Properties with values for just one material (7, in this case) are not shown.

For each property being compared, the top bar is C10300 copper and the bottom bar is EN 1.4507 stainless steel.

Metric UnitsUS Customary Units

Mechanical Properties

Elastic (Young's, Tensile) Modulus, GPa 120
200
Elongation at Break, % 2.6 to 50
25
Poisson's Ratio 0.34
0.27
Shear Modulus, GPa 43
80
Shear Strength, MPa 160 to 240
530
Tensile Strength: Ultimate (UTS), MPa 230 to 410
840
Tensile Strength: Yield (Proof), MPa 77 to 400
590

Thermal Properties

Latent Heat of Fusion, J/g 210
300
Maximum Temperature: Mechanical, °C 200
1100
Melting Completion (Liquidus), °C 1080
1440
Melting Onset (Solidus), °C 1080
1390
Specific Heat Capacity, J/kg-K 390
470
Thermal Conductivity, W/m-K 390
15
Thermal Expansion, µm/m-K 17
13

Electrical Properties

Electrical Conductivity: Equal Volume, % IACS 99
2.2
Electrical Conductivity: Equal Weight (Specific), % IACS 99
2.5

Otherwise Unclassified Properties

Base Metal Price, % relative 31
21
Density, g/cm3 9.0
7.8
Embodied Carbon, kg CO2/kg material 2.6
4.0
Embodied Energy, MJ/kg 41
55
Embodied Water, L/kg 310
180

Common Calculations

Resilience: Ultimate (Unit Rupture Work), MJ/m3 9.4 to 91
190
Resilience: Unit (Modulus of Resilience), kJ/m3 25 to 690
850
Stiffness to Weight: Axial, points 7.2
14
Stiffness to Weight: Bending, points 18
25
Strength to Weight: Axial, points 7.2 to 13
30
Strength to Weight: Bending, points 9.4 to 14
25
Thermal Diffusivity, mm2/s 110
4.0
Thermal Shock Resistance, points 8.2 to 15
23

Alloy Composition

Carbon (C), % 0
0 to 0.030
Chromium (Cr), % 0
24 to 26
Copper (Cu), % 99.95 to 99.999
1.0 to 2.5
Iron (Fe), % 0
56.4 to 65.8
Manganese (Mn), % 0
0 to 2.0
Molybdenum (Mo), % 0
3.0 to 4.0
Nickel (Ni), % 0
6.0 to 8.0
Nitrogen (N), % 0
0.2 to 0.3
Phosphorus (P), % 0.0010 to 0.0050
0 to 0.035
Silicon (Si), % 0
0 to 0.7
Sulfur (S), % 0
0 to 0.015