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C10400 Copper vs. Grade M30H Nickel

C10400 copper belongs to the copper alloys classification, while grade M30H nickel belongs to the nickel alloys. They have a modest 30% of their average alloy composition in common, which, by itself, doesn't mean much. There are 28 material properties with values for both materials. Properties with values for just one material (4, in this case) are not shown.

For each property being compared, the top bar is C10400 copper and the bottom bar is grade M30H nickel.

Metric UnitsUS Customary Units

Mechanical Properties

Elastic (Young's, Tensile) Modulus, GPa 120
160
Elongation at Break, % 2.3 to 50
11
Poisson's Ratio 0.34
0.32
Shear Modulus, GPa 43
61
Tensile Strength: Ultimate (UTS), MPa 230 to 410
770
Tensile Strength: Yield (Proof), MPa 77 to 400
470

Thermal Properties

Latent Heat of Fusion, J/g 210
320
Maximum Temperature: Mechanical, °C 200
900
Melting Completion (Liquidus), °C 1080
1250
Melting Onset (Solidus), °C 1080
1200
Specific Heat Capacity, J/kg-K 390
440
Thermal Conductivity, W/m-K 390
22
Thermal Expansion, µm/m-K 17
13

Electrical Properties

Electrical Conductivity: Equal Volume, % IACS 100
3.3
Electrical Conductivity: Equal Weight (Specific), % IACS 100
3.4

Otherwise Unclassified Properties

Base Metal Price, % relative 32
50
Density, g/cm3 9.0
8.6
Embodied Carbon, kg CO2/kg material 2.6
7.7
Embodied Energy, MJ/kg 42
110
Embodied Water, L/kg 340
250

Common Calculations

Resilience: Ultimate (Unit Rupture Work), MJ/m3 8.5 to 91
75
Resilience: Unit (Modulus of Resilience), kJ/m3 25 to 690
700
Stiffness to Weight: Axial, points 7.2
10
Stiffness to Weight: Bending, points 18
21
Strength to Weight: Axial, points 7.2 to 13
25
Strength to Weight: Bending, points 9.4 to 14
22
Thermal Diffusivity, mm2/s 110
5.7
Thermal Shock Resistance, points 8.2 to 15
27

Alloy Composition


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Carbon (C), % 0
0 to 0.3
Copper (Cu), % 99.9 to 99.973
27 to 33
Iron (Fe), % 0
0 to 3.5
Manganese (Mn), % 0
0 to 1.5
Nickel (Ni), % 0
57.9 to 70.3
Oxygen (O), % 0 to 0.0010
0
Phosphorus (P), % 0
0 to 0.030
Silicon (Si), % 0
2.7 to 3.7
Silver (Ag), % 0.027 to 0.050
0
Sulfur (S), % 0
0 to 0.030
Residuals, % 0 to 0.050
0