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C11100 Copper vs. Solder Alloy 301

C11100 copper belongs to the copper alloys classification, while solder alloy 301 belongs to the otherwise unclassified metals. There are 25 material properties with values for both materials. Properties with values for just one material (5, in this case) are not shown.

For each property being compared, the top bar is C11100 copper and the bottom bar is solder alloy 301.

Metric UnitsUS Customary Units

Mechanical Properties

Elastic (Young's, Tensile) Modulus, GPa 120
40
Elongation at Break, % 1.5
51
Poisson's Ratio 0.34
0.34
Shear Modulus, GPa 44
15
Tensile Strength: Ultimate (UTS), MPa 460
55
Tensile Strength: Yield (Proof), MPa 420
49

Thermal Properties

Latent Heat of Fusion, J/g 210
55
Melting Completion (Liquidus), °C 1080
140
Melting Onset (Solidus), °C 1070
140
Specific Heat Capacity, J/kg-K 390
160
Thermal Conductivity, W/m-K 390
19
Thermal Expansion, µm/m-K 17
14

Electrical Properties

Electrical Conductivity: Equal Volume, % IACS 100
4.7
Electrical Conductivity: Equal Weight (Specific), % IACS 100
4.9

Otherwise Unclassified Properties

Density, g/cm3 9.0
8.7
Embodied Carbon, kg CO2/kg material 2.6
13
Embodied Energy, MJ/kg 41
210

Common Calculations

Resilience: Ultimate (Unit Rupture Work), MJ/m3 6.6
27
Resilience: Unit (Modulus of Resilience), kJ/m3 750
30
Stiffness to Weight: Axial, points 7.2
2.5
Stiffness to Weight: Bending, points 18
13
Strength to Weight: Axial, points 14
1.8
Strength to Weight: Bending, points 15
3.7
Thermal Diffusivity, mm2/s 110
13
Thermal Shock Resistance, points 16
7.2

Alloy Composition


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Aluminum (Al), % 0
0 to 0.0010
Antimony (Sb), % 0
0 to 0.1
Arsenic (As), % 0
0 to 0.030
Bismuth (Bi), % 0
56.5 to 59
Cadmium (Cd), % 0
0 to 0.0020
Copper (Cu), % 99.9 to 100
0 to 0.050
Gold (Au), % 0
0 to 0.050
Indium (In), % 0
0 to 0.1
Iron (Fe), % 0
0 to 0.020
Lead (Pb), % 0
0 to 0.070
Nickel (Ni), % 0
0 to 0.010
Silver (Ag), % 0
0 to 0.1
Tin (Sn), % 0
41 to 43
Zinc (Zn), % 0
0 to 0.0010
Residuals, % 0 to 0.1
0