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C11300 Copper vs. Grade M30C Nickel

C11300 copper belongs to the copper alloys classification, while grade M30C nickel belongs to the nickel alloys. They have a modest 30% of their average alloy composition in common, which, by itself, doesn't mean much. There are 28 material properties with values for both materials. Properties with values for just one material (4, in this case) are not shown.

For each property being compared, the top bar is C11300 copper and the bottom bar is grade M30C nickel.

Metric UnitsUS Customary Units

Mechanical Properties

Elastic (Young's, Tensile) Modulus, GPa 120
160
Elongation at Break, % 2.3 to 50
29
Poisson's Ratio 0.34
0.32
Shear Modulus, GPa 43
61
Tensile Strength: Ultimate (UTS), MPa 230 to 410
510
Tensile Strength: Yield (Proof), MPa 77 to 400
250

Thermal Properties

Latent Heat of Fusion, J/g 210
290
Maximum Temperature: Mechanical, °C 200
900
Melting Completion (Liquidus), °C 1080
1290
Melting Onset (Solidus), °C 1030
1240
Specific Heat Capacity, J/kg-K 390
430
Thermal Conductivity, W/m-K 390
22
Thermal Expansion, µm/m-K 17
13

Electrical Properties

Electrical Conductivity: Equal Volume, % IACS 100
3.3
Electrical Conductivity: Equal Weight (Specific), % IACS 100
3.4

Otherwise Unclassified Properties

Base Metal Price, % relative 32
60
Density, g/cm3 9.0
8.8
Embodied Carbon, kg CO2/kg material 2.6
9.5
Embodied Energy, MJ/kg 42
140
Embodied Water, L/kg 340
250

Common Calculations

Resilience: Ultimate (Unit Rupture Work), MJ/m3 8.5 to 91
120
Resilience: Unit (Modulus of Resilience), kJ/m3 25 to 690
200
Stiffness to Weight: Axial, points 7.2
10
Stiffness to Weight: Bending, points 18
21
Strength to Weight: Axial, points 7.2 to 13
16
Strength to Weight: Bending, points 9.4 to 14
16
Thermal Diffusivity, mm2/s 110
5.7
Thermal Shock Resistance, points 8.2 to 15
18

Alloy Composition


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Carbon (C), % 0
0 to 0.3
Copper (Cu), % 99.85 to 99.973
26 to 33
Iron (Fe), % 0
0 to 3.5
Manganese (Mn), % 0
0 to 1.5
Nickel (Ni), % 0
56.6 to 72
Niobium (Nb), % 0
1.0 to 3.0
Phosphorus (P), % 0
0 to 0.030
Silicon (Si), % 0
1.0 to 2.0
Silver (Ag), % 0.027 to 0.050
0
Sulfur (S), % 0
0 to 0.030
Residuals, % 0 to 0.1
0