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C11300 Copper vs. S82011 Stainless Steel

C11300 copper belongs to the copper alloys classification, while S82011 stainless steel belongs to the iron alloys. There are 29 material properties with values for both materials. Properties with values for just one material (7, in this case) are not shown.

For each property being compared, the top bar is C11300 copper and the bottom bar is S82011 stainless steel.

Metric UnitsUS Customary Units

Mechanical Properties

Elastic (Young's, Tensile) Modulus, GPa 120
200
Elongation at Break, % 2.3 to 50
34
Poisson's Ratio 0.34
0.27
Shear Modulus, GPa 43
78
Shear Strength, MPa 160 to 240
490
Tensile Strength: Ultimate (UTS), MPa 230 to 410
730
Tensile Strength: Yield (Proof), MPa 77 to 400
510

Thermal Properties

Latent Heat of Fusion, J/g 210
290
Maximum Temperature: Mechanical, °C 200
1010
Melting Completion (Liquidus), °C 1080
1420
Melting Onset (Solidus), °C 1030
1380
Specific Heat Capacity, J/kg-K 390
480
Thermal Conductivity, W/m-K 390
15
Thermal Expansion, µm/m-K 17
13

Electrical Properties

Electrical Conductivity: Equal Volume, % IACS 100
2.2
Electrical Conductivity: Equal Weight (Specific), % IACS 100
2.5

Otherwise Unclassified Properties

Base Metal Price, % relative 32
12
Density, g/cm3 9.0
7.7
Embodied Carbon, kg CO2/kg material 2.6
2.6
Embodied Energy, MJ/kg 42
37
Embodied Water, L/kg 340
150

Common Calculations

Resilience: Ultimate (Unit Rupture Work), MJ/m3 8.5 to 91
220
Resilience: Unit (Modulus of Resilience), kJ/m3 25 to 690
660
Stiffness to Weight: Axial, points 7.2
14
Stiffness to Weight: Bending, points 18
25
Strength to Weight: Axial, points 7.2 to 13
27
Strength to Weight: Bending, points 9.4 to 14
24
Thermal Diffusivity, mm2/s 110
4.0
Thermal Shock Resistance, points 8.2 to 15
20

Alloy Composition


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Carbon (C), % 0
0 to 0.030
Chromium (Cr), % 0
20.5 to 23.5
Copper (Cu), % 99.85 to 99.973
0 to 0.5
Iron (Fe), % 0
68.6 to 76.3
Manganese (Mn), % 0
2.0 to 3.0
Molybdenum (Mo), % 0
0.1 to 1.0
Nickel (Ni), % 0
1.0 to 2.0
Nitrogen (N), % 0
0.15 to 0.27
Phosphorus (P), % 0
0 to 0.040
Silicon (Si), % 0
0 to 1.0
Silver (Ag), % 0.027 to 0.050
0
Sulfur (S), % 0
0 to 0.020
Residuals, % 0 to 0.1
0