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C11400 Copper vs. S30530 Stainless Steel

C11400 copper belongs to the copper alloys classification, while S30530 stainless steel belongs to the iron alloys. There are 30 material properties with values for both materials. Properties with values for just one material (6, in this case) are not shown.

For each property being compared, the top bar is C11400 copper and the bottom bar is S30530 stainless steel.

Metric UnitsUS Customary Units

Mechanical Properties

Elastic (Young's, Tensile) Modulus, GPa 120
200
Elongation at Break, % 2.8 to 51
46
Poisson's Ratio 0.34
0.28
Rockwell B Hardness 10 to 62
79
Shear Modulus, GPa 43
77
Shear Strength, MPa 150 to 210
410
Tensile Strength: Ultimate (UTS), MPa 220 to 400
590
Tensile Strength: Yield (Proof), MPa 75 to 400
230

Thermal Properties

Latent Heat of Fusion, J/g 210
310
Maximum Temperature: Mechanical, °C 200
970
Melting Completion (Liquidus), °C 1080
1410
Melting Onset (Solidus), °C 1030
1370
Specific Heat Capacity, J/kg-K 390
480
Thermal Conductivity, W/m-K 390
15
Thermal Expansion, µm/m-K 17
16

Electrical Properties

Electrical Conductivity: Equal Volume, % IACS 100
2.1
Electrical Conductivity: Equal Weight (Specific), % IACS 100
2.4

Otherwise Unclassified Properties

Base Metal Price, % relative 32
18
Density, g/cm3 9.0
7.8
Embodied Carbon, kg CO2/kg material 2.6
3.4
Embodied Energy, MJ/kg 42
48
Embodied Water, L/kg 350
150

Common Calculations

Resilience: Ultimate (Unit Rupture Work), MJ/m3 11 to 90
210
Resilience: Unit (Modulus of Resilience), kJ/m3 24 to 680
130
Stiffness to Weight: Axial, points 7.2
14
Stiffness to Weight: Bending, points 18
25
Strength to Weight: Axial, points 6.8 to 12
21
Strength to Weight: Bending, points 9.1 to 14
20
Thermal Diffusivity, mm2/s 110
4.1
Thermal Shock Resistance, points 7.8 to 14
13

Alloy Composition


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Carbon (C), % 0
0 to 0.080
Chromium (Cr), % 0
17 to 20.5
Copper (Cu), % 99.84 to 99.966
0.75 to 3.5
Iron (Fe), % 0
58.4 to 72.5
Manganese (Mn), % 0
0 to 2.0
Molybdenum (Mo), % 0
0.75 to 1.5
Nickel (Ni), % 0
8.5 to 11.5
Phosphorus (P), % 0
0 to 0.045
Silicon (Si), % 0
0.5 to 2.5
Silver (Ag), % 0.034 to 0.060
0
Sulfur (S), % 0
0 to 0.030
Residuals, % 0 to 0.1
0