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C12500 Copper vs. EN 2.4889 Nickel

C12500 copper belongs to the copper alloys classification, while EN 2.4889 nickel belongs to the nickel alloys. There are 29 material properties with values for both materials. Properties with values for just one material (4, in this case) are not shown.

For each property being compared, the top bar is C12500 copper and the bottom bar is EN 2.4889 nickel.

Metric UnitsUS Customary Units

Mechanical Properties

Elastic (Young's, Tensile) Modulus, GPa 120
200
Elongation at Break, % 1.5 to 50
39
Poisson's Ratio 0.34
0.28
Shear Modulus, GPa 43
77
Shear Strength, MPa 150 to 220
490
Tensile Strength: Ultimate (UTS), MPa 220 to 420
720
Tensile Strength: Yield (Proof), MPa 75 to 390
270

Thermal Properties

Latent Heat of Fusion, J/g 210
350
Maximum Temperature: Mechanical, °C 200
1200
Melting Completion (Liquidus), °C 1080
1350
Melting Onset (Solidus), °C 1070
1300
Specific Heat Capacity, J/kg-K 390
480
Thermal Conductivity, W/m-K 350
13
Thermal Expansion, µm/m-K 17
14

Electrical Properties

Electrical Conductivity: Equal Volume, % IACS 92
1.5
Electrical Conductivity: Equal Weight (Specific), % IACS 93
1.6

Otherwise Unclassified Properties

Base Metal Price, % relative 31
42
Density, g/cm3 8.9
8.0
Embodied Carbon, kg CO2/kg material 2.6
6.9
Embodied Energy, MJ/kg 41
98
Embodied Water, L/kg 310
250

Common Calculations

Resilience: Ultimate (Unit Rupture Work), MJ/m3 5.6 to 88
220
Resilience: Unit (Modulus of Resilience), kJ/m3 24 to 660
180
Stiffness to Weight: Axial, points 7.2
14
Stiffness to Weight: Bending, points 18
24
Strength to Weight: Axial, points 6.9 to 13
25
Strength to Weight: Bending, points 9.1 to 14
22
Thermal Diffusivity, mm2/s 100
3.4
Thermal Shock Resistance, points 7.8 to 15
19

Alloy Composition


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Antimony (Sb), % 0 to 0.0030
0
Arsenic (As), % 0 to 0.012
0
Bismuth (Bi), % 0 to 0.0030
0
Carbon (C), % 0
0.050 to 0.12
Cerium (Ce), % 0
0.030 to 0.090
Chromium (Cr), % 0
26 to 29
Copper (Cu), % 99.88 to 100
0 to 0.3
Iron (Fe), % 0
21 to 25
Lead (Pb), % 0 to 0.0040
0
Manganese (Mn), % 0
0 to 1.0
Nickel (Ni), % 0 to 0.050
45 to 50.4
Phosphorus (P), % 0
0 to 0.020
Silicon (Si), % 0
2.5 to 3.0
Sulfur (S), % 0
0 to 0.010
Tellurium (Te), % 0 to 0.025
0
Residuals, % 0 to 0.3
0