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C12900 Copper vs. CC381H Copper-nickel

Both C12900 copper and CC381H copper-nickel are copper alloys. They have 67% of their average alloy composition in common. There are 28 material properties with values for both materials. Properties with values for just one material (3, in this case) are not shown.

For each property being compared, the top bar is C12900 copper and the bottom bar is CC381H copper-nickel.

Metric UnitsUS Customary Units

Mechanical Properties

Elastic (Young's, Tensile) Modulus, GPa 120
140
Elongation at Break, % 2.8 to 50
20
Poisson's Ratio 0.34
0.33
Shear Modulus, GPa 43
52
Tensile Strength: Ultimate (UTS), MPa 220 to 420
380
Tensile Strength: Yield (Proof), MPa 75 to 380
140

Thermal Properties

Latent Heat of Fusion, J/g 210
240
Maximum Temperature: Mechanical, °C 200
260
Melting Completion (Liquidus), °C 1080
1180
Melting Onset (Solidus), °C 1030
1120
Specific Heat Capacity, J/kg-K 390
410
Thermal Conductivity, W/m-K 380
30
Thermal Expansion, µm/m-K 17
16

Electrical Properties

Electrical Conductivity: Equal Volume, % IACS 98
6.8
Electrical Conductivity: Equal Weight (Specific), % IACS 98
6.9

Otherwise Unclassified Properties

Base Metal Price, % relative 32
40
Density, g/cm3 9.0
8.9
Embodied Carbon, kg CO2/kg material 2.6
5.0
Embodied Energy, MJ/kg 41
73
Embodied Water, L/kg 330
280

Common Calculations

Resilience: Ultimate (Unit Rupture Work), MJ/m3 11 to 88
60
Resilience: Unit (Modulus of Resilience), kJ/m3 24 to 640
68
Stiffness to Weight: Axial, points 7.2
8.6
Stiffness to Weight: Bending, points 18
19
Strength to Weight: Axial, points 6.8 to 13
12
Strength to Weight: Bending, points 9.1 to 14
13
Thermal Diffusivity, mm2/s 110
8.4
Thermal Shock Resistance, points 7.8 to 15
13

Alloy Composition

Aluminum (Al), % 0
0 to 0.010
Antimony (Sb), % 0 to 0.0030
0
Arsenic (As), % 0 to 0.012
0
Bismuth (Bi), % 0 to 0.0030
0
Carbon (C), % 0
0 to 0.030
Copper (Cu), % 99.88 to 100
64.5 to 69.9
Iron (Fe), % 0
0.5 to 1.5
Lead (Pb), % 0 to 0.0040
0 to 0.030
Manganese (Mn), % 0
0.6 to 1.2
Nickel (Ni), % 0 to 0.050
29 to 31
Phosphorus (P), % 0
0 to 0.010
Silicon (Si), % 0
0 to 0.1
Silver (Ag), % 0 to 0.054
0
Sulfur (S), % 0
0 to 0.010
Tellurium (Te), % 0 to 0.025
0
Zinc (Zn), % 0
0 to 0.5