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C12900 Copper vs. Nickel 201

C12900 copper belongs to the copper alloys classification, while nickel 201 belongs to the nickel alloys. There are 29 material properties with values for both materials. Properties with values for just one material (3, in this case) are not shown.

For each property being compared, the top bar is C12900 copper and the bottom bar is nickel 201.

Metric UnitsUS Customary Units

Mechanical Properties

Elastic (Young's, Tensile) Modulus, GPa 120
180
Elongation at Break, % 2.8 to 50
4.5 to 45
Poisson's Ratio 0.34
0.31
Shear Modulus, GPa 43
70
Shear Strength, MPa 150 to 210
270 to 380
Tensile Strength: Ultimate (UTS), MPa 220 to 420
390 to 660
Tensile Strength: Yield (Proof), MPa 75 to 380
80 to 510

Thermal Properties

Latent Heat of Fusion, J/g 210
290
Maximum Temperature: Mechanical, °C 200
900
Melting Completion (Liquidus), °C 1080
1450
Melting Onset (Solidus), °C 1030
1440
Specific Heat Capacity, J/kg-K 390
440
Thermal Conductivity, W/m-K 380
78
Thermal Expansion, µm/m-K 17
13

Electrical Properties

Electrical Conductivity: Equal Volume, % IACS 98
19
Electrical Conductivity: Equal Weight (Specific), % IACS 98
19

Otherwise Unclassified Properties

Base Metal Price, % relative 32
65
Density, g/cm3 9.0
8.9
Embodied Carbon, kg CO2/kg material 2.6
11
Embodied Energy, MJ/kg 41
150
Embodied Water, L/kg 330
230

Common Calculations

Resilience: Ultimate (Unit Rupture Work), MJ/m3 11 to 88
25 to 130
Resilience: Unit (Modulus of Resilience), kJ/m3 24 to 640
17 to 720
Stiffness to Weight: Axial, points 7.2
11
Stiffness to Weight: Bending, points 18
21
Strength to Weight: Axial, points 6.8 to 13
12 to 20
Strength to Weight: Bending, points 9.1 to 14
13 to 19
Thermal Diffusivity, mm2/s 110
20
Thermal Shock Resistance, points 7.8 to 15
11 to 19

Alloy Composition

Antimony (Sb), % 0 to 0.0030
0
Arsenic (As), % 0 to 0.012
0
Bismuth (Bi), % 0 to 0.0030
0
Carbon (C), % 0
0 to 0.020
Copper (Cu), % 99.88 to 100
0 to 0.25
Iron (Fe), % 0
0 to 0.4
Lead (Pb), % 0 to 0.0040
0
Manganese (Mn), % 0
0 to 0.35
Nickel (Ni), % 0 to 0.050
99 to 100
Silicon (Si), % 0
0 to 0.35
Silver (Ag), % 0 to 0.054
0
Sulfur (S), % 0
0 to 0.010
Tellurium (Te), % 0 to 0.025
0