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C12900 Copper vs. C70260 Copper

Both C12900 copper and C70260 copper are copper alloys. They have a very high 97% of their average alloy composition in common. There are 29 material properties with values for both materials. Properties with values for just one material (1, in this case) are not shown.

For each property being compared, the top bar is C12900 copper and the bottom bar is C70260 copper.

Metric UnitsUS Customary Units

Mechanical Properties

Elastic (Young's, Tensile) Modulus, GPa 120
120
Elongation at Break, % 2.8 to 50
9.5 to 19
Poisson's Ratio 0.34
0.34
Shear Modulus, GPa 43
44
Shear Strength, MPa 150 to 210
320 to 450
Tensile Strength: Ultimate (UTS), MPa 220 to 420
520 to 760
Tensile Strength: Yield (Proof), MPa 75 to 380
410 to 650

Thermal Properties

Latent Heat of Fusion, J/g 210
220
Maximum Temperature: Mechanical, °C 200
200
Melting Completion (Liquidus), °C 1080
1060
Melting Onset (Solidus), °C 1030
1040
Specific Heat Capacity, J/kg-K 390
390
Thermal Conductivity, W/m-K 380
160
Thermal Expansion, µm/m-K 17
17

Electrical Properties

Electrical Conductivity: Equal Volume, % IACS 98
40 to 50
Electrical Conductivity: Equal Weight (Specific), % IACS 98
40 to 51

Otherwise Unclassified Properties

Base Metal Price, % relative 32
31
Density, g/cm3 9.0
8.9
Embodied Carbon, kg CO2/kg material 2.6
2.7
Embodied Energy, MJ/kg 41
43
Embodied Water, L/kg 330
310

Common Calculations

Resilience: Ultimate (Unit Rupture Work), MJ/m3 11 to 88
46 to 140
Resilience: Unit (Modulus of Resilience), kJ/m3 24 to 640
710 to 1810
Stiffness to Weight: Axial, points 7.2
7.3
Stiffness to Weight: Bending, points 18
18
Strength to Weight: Axial, points 6.8 to 13
16 to 24
Strength to Weight: Bending, points 9.1 to 14
16 to 21
Thermal Diffusivity, mm2/s 110
45
Thermal Shock Resistance, points 7.8 to 15
18 to 27

Alloy Composition


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Antimony (Sb), % 0 to 0.0030
0
Arsenic (As), % 0 to 0.012
0
Bismuth (Bi), % 0 to 0.0030
0
Copper (Cu), % 99.88 to 100
95.8 to 98.8
Lead (Pb), % 0 to 0.0040
0
Nickel (Ni), % 0 to 0.050
1.0 to 3.0
Phosphorus (P), % 0
0 to 0.010
Silicon (Si), % 0
0.2 to 0.7
Silver (Ag), % 0 to 0.054
0
Tellurium (Te), % 0 to 0.025
0
Residuals, % 0
0 to 0.5