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C12900 Copper vs. C96200 Copper-nickel

Both C12900 copper and C96200 copper-nickel are copper alloys. They have 87% of their average alloy composition in common. There are 28 material properties with values for both materials. Properties with values for just one material (2, in this case) are not shown.

For each property being compared, the top bar is C12900 copper and the bottom bar is C96200 copper-nickel.

Metric UnitsUS Customary Units

Mechanical Properties

Elastic (Young's, Tensile) Modulus, GPa 120
120
Elongation at Break, % 2.8 to 50
23
Poisson's Ratio 0.34
0.34
Shear Modulus, GPa 43
46
Tensile Strength: Ultimate (UTS), MPa 220 to 420
350
Tensile Strength: Yield (Proof), MPa 75 to 380
190

Thermal Properties

Latent Heat of Fusion, J/g 210
220
Maximum Temperature: Mechanical, °C 200
220
Melting Completion (Liquidus), °C 1080
1150
Melting Onset (Solidus), °C 1030
1100
Specific Heat Capacity, J/kg-K 390
390
Thermal Conductivity, W/m-K 380
45
Thermal Expansion, µm/m-K 17
17

Electrical Properties

Electrical Conductivity: Equal Volume, % IACS 98
11
Electrical Conductivity: Equal Weight (Specific), % IACS 98
11

Otherwise Unclassified Properties

Base Metal Price, % relative 32
36
Density, g/cm3 9.0
8.9
Embodied Carbon, kg CO2/kg material 2.6
3.8
Embodied Energy, MJ/kg 41
58
Embodied Water, L/kg 330
300

Common Calculations

Resilience: Ultimate (Unit Rupture Work), MJ/m3 11 to 88
68
Resilience: Unit (Modulus of Resilience), kJ/m3 24 to 640
150
Stiffness to Weight: Axial, points 7.2
7.8
Stiffness to Weight: Bending, points 18
19
Strength to Weight: Axial, points 6.8 to 13
11
Strength to Weight: Bending, points 9.1 to 14
13
Thermal Diffusivity, mm2/s 110
13
Thermal Shock Resistance, points 7.8 to 15
12

Alloy Composition


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Antimony (Sb), % 0 to 0.0030
0
Arsenic (As), % 0 to 0.012
0
Bismuth (Bi), % 0 to 0.0030
0
Carbon (C), % 0
0 to 0.1
Copper (Cu), % 99.88 to 100
83.6 to 90
Iron (Fe), % 0
1.0 to 1.8
Lead (Pb), % 0 to 0.0040
0 to 0.010
Manganese (Mn), % 0
0 to 1.5
Nickel (Ni), % 0 to 0.050
9.0 to 11
Niobium (Nb), % 0
0 to 1.0
Phosphorus (P), % 0
0 to 0.020
Silicon (Si), % 0
0 to 0.5
Silver (Ag), % 0 to 0.054
0
Sulfur (S), % 0
0 to 0.020
Tellurium (Te), % 0 to 0.025
0
Residuals, % 0
0 to 0.5