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C12900 Copper vs. C96300 Copper-nickel

Both C12900 copper and C96300 copper-nickel are copper alloys. They have 77% of their average alloy composition in common. There are 28 material properties with values for both materials. Properties with values for just one material (3, in this case) are not shown.

For each property being compared, the top bar is C12900 copper and the bottom bar is C96300 copper-nickel.

Metric UnitsUS Customary Units

Mechanical Properties

Elastic (Young's, Tensile) Modulus, GPa 120
130
Elongation at Break, % 2.8 to 50
11
Poisson's Ratio 0.34
0.33
Shear Modulus, GPa 43
49
Tensile Strength: Ultimate (UTS), MPa 220 to 420
580
Tensile Strength: Yield (Proof), MPa 75 to 380
430

Thermal Properties

Latent Heat of Fusion, J/g 210
230
Maximum Temperature: Mechanical, °C 200
240
Melting Completion (Liquidus), °C 1080
1200
Melting Onset (Solidus), °C 1030
1150
Specific Heat Capacity, J/kg-K 390
400
Thermal Conductivity, W/m-K 380
37
Thermal Expansion, µm/m-K 17
16

Electrical Properties

Electrical Conductivity: Equal Volume, % IACS 98
6.0
Electrical Conductivity: Equal Weight (Specific), % IACS 98
6.1

Otherwise Unclassified Properties

Base Metal Price, % relative 32
42
Density, g/cm3 9.0
8.9
Embodied Carbon, kg CO2/kg material 2.6
5.1
Embodied Energy, MJ/kg 41
76
Embodied Water, L/kg 330
290

Common Calculations

Resilience: Ultimate (Unit Rupture Work), MJ/m3 11 to 88
59
Resilience: Unit (Modulus of Resilience), kJ/m3 24 to 640
720
Stiffness to Weight: Axial, points 7.2
8.2
Stiffness to Weight: Bending, points 18
19
Strength to Weight: Axial, points 6.8 to 13
18
Strength to Weight: Bending, points 9.1 to 14
17
Thermal Diffusivity, mm2/s 110
10
Thermal Shock Resistance, points 7.8 to 15
20

Alloy Composition


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Antimony (Sb), % 0 to 0.0030
0
Arsenic (As), % 0 to 0.012
0
Bismuth (Bi), % 0 to 0.0030
0
Carbon (C), % 0
0 to 0.15
Copper (Cu), % 99.88 to 100
72.3 to 80.8
Iron (Fe), % 0
0.5 to 1.5
Lead (Pb), % 0 to 0.0040
0 to 0.010
Manganese (Mn), % 0
0.25 to 1.5
Nickel (Ni), % 0 to 0.050
18 to 22
Niobium (Nb), % 0
0.5 to 1.5
Phosphorus (P), % 0
0 to 0.020
Silicon (Si), % 0
0 to 0.5
Silver (Ag), % 0 to 0.054
0
Sulfur (S), % 0
0 to 0.020
Tellurium (Te), % 0 to 0.025
0
Residuals, % 0
0 to 0.5